CPUs

MediaTek Dimensity 7300 vs Apple A16 Bionic Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2.5GHz
6 Cores(2P+4E)
6 Threads(2P+4E)
3.44GHz
TDP
-
TDP
5W
Bandwidth
51.2GB/s
·
Bandwidth
51.2GB/s
LPDDR5
iGPU
iGPU
··
563.2 GFLOPSFP16
··
1.71 TFLOPSFP16

Dimensity 7300Dimensity 73001,043
x1
A16 BionicA16 Bionic2,560
x2.45

8 Cores
4P
4E
6 Cores
2P
4E
8 Threads
4P
4E
6 Threads
2P
4E

Base Clock
2.5GHz
Base Clock
3.44GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
32KB E
L1i
192KB P
128KB E
L1d
64KB P
32KB E
L1d
128KB P
64KB E
L2
1MB P
128KB E
-
-
L2
16MB P shared
4MB E shared
L3
4MB
L3
-
SLC Cache
-
SLC Cache
24MB

Type
·
Type
LPDDR5
Max Memory
-
Max Memory
8GB
ECC
No
ECC
No
Channels
4
Channels
1
Bus Width
64-bit
Bus Width
64-bit
Speed
6400MT/s
Speed
6400MT/s
Bandwidth
51.2GB/s
Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s

TDP
-
TDP
5W

-
PCIe
PCIe 4.0 x4
7.9GB/sBandwidth

iGPU
iGPU
Shaders
128
Shaders
640
Boost Clock
1.1GHz
Boost Clock
1.34GHz
··
563.2 GFLOPSFP16
··
1.71 TFLOPSFP16

NPU Model
MediaTek APU 655
NPU Model
H15 Themis
NPU Cores
-
NPU Cores
16
NPU Clock
-
NPU Clock
2.06GHz
Performance
-
Performance
17 TOPSFP16

Modem Model
MT 5G+
Modem Model
-
Cellular
5G
Cellular
-
Peak Down
Up to 3.3Gbps
Peak Down
-
Peak Up
Up to 900Mbps
Peak Up
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
Family
Branding
Dimensity  branding
Branding
A16  branding
Codename
-
-
Cortex-A78P-Core
Cortex-A55E-Core
Codename
Crete
A16Variant
EverestP-Core
Sawtooth E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Jun 1, 2024
Release Date
Sep 16, 2022

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N7
Fabrication Node
N4P
Die Size
-
Die Size
115mm²
Transistor Count
-
Transistor Count
16 Billion
Transistor Density
-
Transistor Density
139 MTr/mm²

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