CPUs

MediaTek Dimensity 7300 vs Qualcomm Snapdragon 765G Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2.5GHz
8 Cores(1P+1M+6E)
8 Threads(1P+1M+6E)
2.4GHz
TDP
-
TDP
5W
Bandwidth
51.2GB/s
·
Bandwidth
17.1GB/s
LPDDR4X
iGPU
iGPU
··
563.2 GFLOPSFP16
··
1.15 TFLOPSFP16

Dimensity 7300Dimensity 73001,043
x1.32
Snapdragon 765GSnapdragon 765G789
x1

8 Cores
4P
-
4E
8 Cores
1P
1M
6E
8 Threads
4P
-
4E
8 Threads
1P
1M
6E

Base Clock
2.5GHz
Base Clock
2.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
-
32KB E
L1i
64KB P
64KB M
32KB E
L1d
64KB P
-
32KB E
L1d
64KB P
64KB M
32KB E
L2
1MB P
-
128KB E
L2
512KB P
256KB M
128KB E
L3
4MB
L3
-
SLC Cache
-
SLC Cache
1MB

Type
·
Type
LPDDR4X
Max Memory
-
Max Memory
16GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
32-bit
Speed
6400MT/s
Speed
4266MT/s
Bandwidth
51.2GB/s
Bandwidth
17.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
17.1GB/s

TDP
-
TDP
5W

iGPU
iGPU
Shaders
128
Shaders
384
Boost Clock
1.1GHz
Boost Clock
750MHz
··
563.2 GFLOPSFP16
··
1.15 TFLOPSFP16

NPU Model
MediaTek APU 655
NPU Model
Hexagon 696
Performance
-
Performance
5.4 TOPS

Modem Model
MT 5G+
Modem Model
X52
Cellular
5G
Cellular
5G mmWave
Peak Down
Up to 3.3Gbps
Peak Down
Up to 3.7Gbps
Peak Up
Up to 900Mbps
Peak Up
Up to 1.6Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 475ARMv8.2-A
Family
Family
Branding
Dimensity  branding
Branding
Snapdragon  branding
Codename
Cortex-A78P-Core
-
Cortex-A55E-Core
Codename
Cortex-A76P-Core
Cortex-A76M-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Jun 1, 2024
Release Date
Jan 20, 2020

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N7
Fabrication Node
7LPP

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