CPUs

MediaTek Dimensity 7300 vs Qualcomm Snapdragon 8 Gen 2 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2.5GHz
8 Cores(1P+4M+3E)
8 Threads(1P+4M+3E)
3.2GHz
TDP
-
TDP
5W
Bandwidth
51.2GB/s
·
Bandwidth
67.2GB/s
LPDDR5X
iGPU
iGPU
··
563.2 GFLOPSFP16
··
4.18 TFLOPSFP16

Dimensity 7300Dimensity 73001,043
x1
Snapdragon 8 Gen 2Snapdragon 8 Gen 21,666
x1.60

8 Cores
4P
-
4E
8 Cores
1P
4M
3E
8 Threads
4P
-
4E
8 Threads
1P
4M
3E

Base Clock
2.5GHz
Base Clock
3.2GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
-
32KB E
L1i
64KB P
64KB M
32KB E
L1d
64KB P
-
32KB E
L1d
64KB P
64KB M
32KB E
L2
1MB P
-
128KB E
L2
1MB P
512KB M
128KB E
L3
4MB
L3
8MB
SLC Cache
-
SLC Cache
4MB

Type
·
Type
LPDDR5X
Max Memory
-
Max Memory
24GB
ECC
No
ECC
No
Channels
4
Channels
4
Bus Width
64-bit
Bus Width
64-bit
Speed
6400MT/s
Speed
8400MT/s
Bandwidth
51.2GB/s
Bandwidth
67.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
67.2GB/s

TDP
-
TDP
5W

iGPU
iGPU
Shaders
128
Shaders
1536
Boost Clock
1.1GHz
Boost Clock
680MHz
··
563.2 GFLOPSFP16
··
4.18 TFLOPSFP16

NPU Model
MediaTek APU 655
NPU Model
Hexagon

Modem Model
MT 5G+
Modem Model
X70
Cellular
5G
Cellular
5G mmWave
Peak Down
Up to 3.3Gbps
Peak Down
Up to 10.0Gbps
Peak Up
Up to 900Mbps
Peak Up
Up to 3.5Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
KryoARMv9.0-A
Family
Family
Branding
Dimensity  branding
Branding
Snapdragon 8 Gen 2  branding
Codename
-
Cortex-A78P-Core
-
Cortex-A55E-Core
Codename
Snapdragon 8 Gen 2Variant
Cortex-X3P-Core
Cortex-A715M-Core
Cortex-A510E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Jun 1, 2024
Release Date
Oct 12, 2022

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N7
Fabrication Node
N4
Die Size
-
Die Size
121mm²

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