MediaTek Dimensity 7300 vs Qualcomm Snapdragon 8 Gen 3 Galaxy Full Specs
8 Cores(4P+4E) 8 Threads(4P+4E) 2.5GHz | 8 Cores(1P+5M+2E) 8 Threads(1P+5M+2E) 3.39GHz |
TDP - | TDP 5W |
Bandwidth 51.2GB/s · | Bandwidth 76.8GB/s LPDDR5X |
iGPU | iGPU |
·· 563.2 GFLOPSFP16 | ·· 5.53 TFLOPSFP16 |
Dimensity 73001,043
Snapdragon 8 Gen 3 Galaxy2,2718 Cores 4P - 4E | 8 Cores 1P 5M 2E |
8 Threads 4P - 4E | 8 Threads 1P 5M 2E |
Base Clock 2.5GHz | Base Clock 3.39GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P - 32KB E | L1i 64KB P 64KB M 32KB E |
L1d 64KB P - 32KB E | L1d 64KB P 64KB M 32KB E |
L2 1MB P - 128KB E | L2 1MB P 512KB M 128KB E |
L3 4MB | L3 12MB |
SLC Cache - | SLC Cache 4MB |
Type · | Type LPDDR5X |
Max Memory - | Max Memory 24GB |
ECC No | ECC No |
Channels 4 | Channels 4 |
Bus Width 64-bit | Bus Width 64-bit |
Speed 6400MT/s | Speed 9600MT/s |
Bandwidth 51.2GB/s | Bandwidth 76.8GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 51.2GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 76.8GB/s |
TDP - | TDP 5W |
iGPU | iGPU |
Shaders 128 | Shaders 1536 |
Boost Clock 1.1GHz | Boost Clock 900MHz |
·· 563.2 GFLOPSFP16 | ·· 5.53 TFLOPSFP16 |
NPU Model MediaTek APU 655 | NPU Model Hexagon |
Performance - | Performance 45 TOPSINT8 |
Modem Model MT 5G+ | Modem Model X75 |
Cellular 5G | Cellular 5G mmWave |
Peak Down Up to 3.3Gbps | Peak Down Up to 10.0Gbps |
Peak Up Up to 900Mbps | Peak Up Up to 3.5Gbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture | Architecture KryoARMv9.0-A |
Family | Family |
Branding  | Branding  |
Codename - Cortex-A78P-Core - Cortex-A55E-Core | Codename Snapdragon 8 Gen 3Variant Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Jun 1, 2024 | Release Date Oct 24, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N7 | Fabrication Node N4P |
Die Size - | Die Size 137mm² |
No images available
No images available
Smartphones | Smartphones |