CPUs

MediaTek Dimensity 7300 vs Samsung Exynos 2200 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2.5GHz
8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
2.8GHz
TDP
-
TDP
5W
Bandwidth
51.2GB/s
·
Bandwidth
51.2GB/s
LPDDR5
iGPU
iGPU
··
563.2 GFLOPSFP16
··
499.2 GFLOPSFP32

Dimensity 7300Dimensity 73001,043
x1
Exynos 2200Exynos 22001,582
x1.52

8 Cores
4P
-
4E
8 Cores
1P
3M
4E
8 Threads
4P
-
4E
8 Threads
1P
3M
4E

Base Clock
2.5GHz
Base Clock
2.8GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
32KB E
L1i
-
L1d
64KB P
32KB E
L1d
-
L2
1MB P
128KB E
L2
-
L3
4MB
L3
-

Type
·
Type
LPDDR5
Max Memory
-
Max Memory
24GB
ECC
No
ECC
No
Channels
4
Channels
4
Bus Width
64-bit
Bus Width
64-bit
Speed
6400MT/s
Speed
6400MT/s
Bandwidth
51.2GB/s
Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s

TDP
-
TDP
5W

iGPU
iGPU
Shaders
128
Shaders
192
Boost Clock
1.1GHz
Boost Clock
1.3GHz
··
563.2 GFLOPSFP16
··
499.2 GFLOPSFP32

NPU Model
MediaTek APU 655
NPU Model
-
NPU Cores
-
NPU Cores
2

Modem Model
MT 5G+
Modem Model
Shannon 7350/3670
Cellular
5G
Cellular
5G
Peak Down
Up to 3.3Gbps
Peak Down
Up to 7.3Gbps
Peak Up
Up to 900Mbps
Peak Up
Up to 3.7Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
Family
-
Branding
Dimensity  branding
Branding
Exynos 2017 branding
Codename
-
Cortex-A78P-Core
-
Cortex-A55E-Core
Codename
Exynos 2200Variant
Cortex-X2P-Core
Cortex-A710M-Core
Cortex-A510E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Jun 1, 2024
Release Date
Jan 1, 2022

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N7
Fabrication Node
4LPE
Die Size
-
Die Size
100mm²

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