CPUs

MediaTek Dimensity 7350 vs Qualcomm Snapdragon 778G Full Specs

8 Cores(2P+6E)
8 Threads(2P+6E)
3GHz
8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
2.4GHz
TDP
-
TDP
5W
Bandwidth
51.2GB/s
·
Bandwidth
25.6GB/s
LPDDR5
iGPU
iGPU
··
1.33 TFLOPSFP16
··
1.13 TFLOPSFP16

Dimensity 7350Dimensity 73501,195
x1.25
Snapdragon 778G954
x1

8 Cores
2P
-
6E
8 Cores
1P
3M
4E
8 Threads
2P
-
6E
8 Threads
1P
3M
4E

Base Clock
3GHz
Base Clock
2.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
-
32KB E
L1i
64KB P
64KB M
32KB E
L1d
64KB P
-
32KB E
L1d
64KB P
64KB M
32KB E
L2
1MB P
-
128KB E
L2
512KB P
512KB M
128KB E
L3
4MB
L3
-
SLC Cache
-
SLC Cache
3MB

Type
·
Type
LPDDR5
Max Memory
-
Max Memory
24GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
32-bit
Speed
6400MT/s
Speed
6400MT/s
Bandwidth
51.2GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s

TDP
-
TDP
5W

iGPU
iGPU
Shaders
256
Shaders
512
Boost Clock
1.3GHz
Boost Clock
550MHz
··
1.33 TFLOPSFP16
··
1.13 TFLOPSFP16

NPU Model
MediaTek APU 657
NPU Model
Hexagon 770
Performance
-
Performance
12 TOPS

Modem Model
MT 5G R2
Modem Model
X53
Cellular
5G
Cellular
5G mmWave
Peak Down
Up to 4.7Gbps
Peak Down
Up to 3.7Gbps
Peak Up
Up to 900Mbps
Peak Up
Up to 2.9Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 670ARMv8.2-A
Family
Family
Branding
Dimensity  branding
Branding
Snapdragon  branding
Codename
Cortex-A715P-Core
-
Cortex-A510E-Core
Codename
Cortex-A78P-Core
Cortex-A78M-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Jul 1, 2024
Release Date
May 19, 2021

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
N6

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