MediaTek Dimensity 8300 vs Samsung Exynos 1330 Full Specs

8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
3.35GHz
8 Cores(2P+6E)
8 Threads(2P+6E)
2.4GHz
TDP
-
TDP
5W
Bandwidth
68.3GB/s
LPDDR5X
Bandwidth
51.2GB/s
·
iGPU
iGPU
··
2.15 TFLOPSFP16
··
243.2 GFLOPSFP16

8 Cores
1P
3M
4E
8 Cores
2P
-
6E
8 Threads
1P
3M
4E
8 Threads
2P
-
6E

Base Clock
3.35GHz
Base Clock
2.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
-
L1d
64KB P
64KB M
32KB E
L1d
-
L2
1MB P
512KB M
128KB E
L2
-

Type
LPDDR5X
Type
·
Max Memory
-
Max Memory
12GB
ECC
No
ECC
No
Channels
4
Channels
4
Bus Width
64-bit
Bus Width
64-bit
Speed
8533MT/s
Speed
6400MT/s
Bandwidth
68.3GB/s
Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
68.3GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
51.2GB/s

TDP
-
TDP
5W

iGPU
iGPU
Shaders
384
Shaders
64
Boost Clock
1.4GHz
Boost Clock
950MHz
··
2.15 TFLOPSFP16
··
243.2 GFLOPSFP16

NPU Model
MediaTek APU 780
NPU Model
-

Modem Model
MT 5G R2
Modem Model
Shannon 2550/1280
Cellular
5G
Cellular
5G
Peak Down
Up to 4.7Gbps
Peak Down
Up to 2.5Gbps
Peak Up
Up to 900Mbps
Peak Up
Up to 1.3Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
Family
-
Branding
Dimensity 8300  branding
Branding
Exynos 5G  branding
Codename
Cortex-A715P-Core
Cortex-A715M-Core
Cortex-A510E-Core
Codename
Cortex-A78P-Core
-
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Nov 21, 2023
Release Date
Feb 23, 2023

Foundry
TSMC
Foundry
-
Fabrication Node
N4P
Fabrication Node
-