CPUs

MediaTek Dimensity 900 vs MediaTek Dimensity 9400+ Full Specs

8 Cores(2P+6E)
8 Threads(2P+6E)
2.4GHz
8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
3.73GHz
Bandwidth
51.2GB/s
LPDDR5
Bandwidth
85.3GB/s
LPDDR5X
iGPU
iGPU
··
460.8 GFLOPSFP16
··
9.9 TFLOPSFP16

Dimensity 900Dimensity 900924
x1
Dimensity 9400+Dimensity 9400+2,940
x3.18

8 Cores
2P
-
6E
8 Cores
1P
3M
4E
8 Threads
2P
-
6E
8 Threads
1P
3M
4E

Base Clock
2.4GHz
Base Clock
3.73GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
-
32KB E
L1i
64KB P
64KB M
32KB E
L1d
64KB P
-
32KB E
L1d
64KB P
64KB M
32KB E
L2
512KB P
-
128KB E
L2
2MB P
1MB M
512KB E
L3
-
L3
12MB
SLC Cache
-
SLC Cache
10MB

Type
LPDDR5
Type
LPDDR5X
Max Memory
-
Max Memory
24GB
ECC
No
ECC
No
Channels
4
Channels
4
Bus Width
64-bit
Bus Width
64-bit
Speed
6400MT/s
Speed
10667MT/s
Bandwidth
51.2GB/s
Bandwidth
85.3GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
85.3GB/s

iGPU
iGPU
Shaders
128
Shaders
1536
Boost Clock
900MHz
Boost Clock
1.61GHz
··
460.8 GFLOPSFP16
··
9.9 TFLOPSFP16

NPU Model
-
NPU Model
MediaTek NPU 890

Modem Model
MT 5G
Modem Model
MT 5G mmWave R3
Cellular
5G
Cellular
5G mmWave
Peak Down
Up to 2.8Gbps
Peak Down
Up to 10.0Gbps
Peak Up
Up to 900Mbps
Peak Up
Up to 7.0Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
Family
Branding
Dimensity  branding
Branding
Dimensity 9400 Plus  branding
Codename
Cortex-A78P-Core
-
Cortex-A55E-Core
Codename
Cortex-X925P-Core
Cortex-X4M-Core
Cortex-A720E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
May 1, 2021
Release Date
Apr 10, 2025

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N7
Fabrication Node
N4P
Die Size
-
Die Size
140mm²
Transistor Count
-
Transistor Count
22.7 Billion
Transistor Density
-
Transistor Density
162 MTr/mm²

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No images available