MediaTek Dimensity 9000 vs Intel N200 Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.05GHz	4 Cores 4 Threads 1GHz
TDP -	TDP 6W
Bandwidth 60GB/s LPDDR5X·LPDDR5	Bandwidth 38.4GB/s LPDDR5·DDR5·DDR4
iGPU Mali-G710 MP10 848MHz	iGPU UHD 32EU 750MHz Gen 12
Peak·FP32·FP16 2.17 TFLOPSFP16	Peak·FP32·FP16 768 GFLOPSFP16
Socket -	Socket BGA 1264

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Dimensity 90001,298

x1

N2001,306

x1.01

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Core Config

8 Cores 1P 3M 4E	4 Cores 4P - -
8 Threads 1P 3M 4E	4 Threads 4P - -

Clocks

Base Clock 3.05GHz	Base Clock 1GHz
Boost Clock -	Boost Clock 3.7GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 64KB P - -
L1d 64KB P 64KB M 32KB E	L1d 32KB P - -
L2 1MB P 512KB M 128KB E -	L2 2MB P shared
L3 8MB	L3 6MB

Memory

Type LPDDR5X·LPDDR5	Type LPDDR5·DDR5·DDR4
Max Memory -	Max Memory 16GB
ECC No	ECC No
Channels 4	Channels 1
Bus Width 64-bit	Bus Width 64-bit
Speed 7500MT/s	Speed 4800MT/s
Bandwidth 60GB/s	Bandwidth 38.4GB/s
Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 60GB/s	Bandwidth Calculator Channels Transfer Rate4800MT/s Calculated Bandwidth 38.4GB/s

Power & Thermals

TDP -	TDP 6W
Max Operating Temp -	Max Operating Temp 105°C Max

Expansion

-	PCIe PCIe 3.0 x9 8.9GB/sBandwidth

iGPU

iGPU Mali-G710 MP10 848MHz	iGPU UHD 32EU 750MHz Gen 12
Shaders 640	Shaders 256
Boost Clock 848MHz	Boost Clock 750MHz
Peak·FP32·FP16 2.17 TFLOPSFP16	Peak·FP32·FP16 768 GFLOPSFP16

NPU

NPU Model MediaTek APU 590

NPU Model GNA 3.0

Cellular

Modem Model MT 5G	Modem Model -
Cellular 5G	Cellular -
Peak Down Up to 2.8Gbps	Peak Down -
Peak Up Up to 900Mbps	Peak Up -

Chip

Manufacturer MediaTek	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture ARMv9.0-A	Architecture Gracemont
Family Dimensity	Family Processor
Branding	Branding
Codename - - Cortex-X2P-Core Cortex-A710M-Core Cortex-A510E-Core	Codename Alder Lake-N Alder Lake-8EVariant GracemontP-Core - -
Market Segment Smartphone	Market Segment Laptop
Release Date Oct 1, 2021	Release Date Jan 3, 2023

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N4P	Fabrication Node Intel 7
Die Size -	Die Size 122mm²
Transistor Count -	Transistor Count 8.5 Billion
Transistor Density -	Transistor Density 70 MTr/mm²

Images

No images available

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Used In

Tablets OnePlus Pad(D9000, Early 2023)

Tablets Surface Go 4(Alder Lake-N, Late 2023)

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