CPUs

MediaTek Dimensity 9000 vs Qualcomm Snapdragon 778G Full Specs

8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
3.05GHz
8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
2.4GHz
TDP
-
TDP
5W
Bandwidth
60GB/s
·
Bandwidth
25.6GB/s
LPDDR5
iGPU
iGPU
··
2.17 TFLOPSFP16
··
1.13 TFLOPSFP16

Dimensity 9000Dimensity 90001,298
x1.36
Snapdragon 778GSnapdragon 778G954
x1

8 Cores
1P
3M
4E
8 Cores
1P
3M
4E
8 Threads
1P
3M
4E
8 Threads
1P
3M
4E

Base Clock
3.05GHz
Base Clock
2.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
64KB P
64KB M
32KB E
L1d
64KB P
64KB M
32KB E
L1d
64KB P
64KB M
32KB E
L2
1MB P
512KB M
128KB E
L2
512KB P
512KB M
128KB E
L3
8MB
L3
-
SLC Cache
-
SLC Cache
3MB

Type
·
Type
LPDDR5
Max Memory
-
Max Memory
24GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
32-bit
Speed
7500MT/s
Speed
6400MT/s
Bandwidth
60GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
60GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s

TDP
-
TDP
5W

iGPU
iGPU
Shaders
640
Shaders
512
Boost Clock
848MHz
Boost Clock
550MHz
··
2.17 TFLOPSFP16
··
1.13 TFLOPSFP16

NPU Model
MediaTek APU 590
NPU Model
Hexagon 770
Performance
-
Performance
12 TOPS

Modem Model
MT 5G
Modem Model
X53
Cellular
5G
Cellular
5G mmWave
Peak Down
Up to 2.8Gbps
Peak Down
Up to 3.7Gbps
Peak Up
Up to 900Mbps
Peak Up
Up to 2.9Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 670ARMv8.2-A
Family
Family
Branding
Dimensity 9000  branding
Branding
Snapdragon  branding
Codename
Cortex-X2P-Core
Cortex-A710M-Core
Cortex-A510E-Core
Codename
Cortex-A78P-Core
Cortex-A78M-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Oct 1, 2021
Release Date
May 19, 2021

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
N6

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