Qualcomm Snapdragon 200 (MSM8212) vs Apple A16 (iPad) Full Specs

Summary

4 Cores 4 Threads 1.2GHz	5 Cores(2P+3E) 5 Threads(2P+3E) 3.44GHz
TDP 5W	TDP 5W
Bandwidth 2.7GB/s LPDDR2	Bandwidth 51.2GB/s LPDDR5
iGPU Adreno 302	iGPU 4-Core A16
Peak·FP32·FP16 25.6 GFLOPSFP16	Peak·FP32·FP16 1.37 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 200 (MSM8212)-

-

A16 (iPad)2,586

x1

Show Top Score

Core Config

4 Cores 4P -	5 Cores 2P 3E
4 Threads 4P -	5 Threads 2P 3E

Clocks

Base Clock 1.2GHz	Base Clock 3.44GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 16KB P -	L1i 192KB P 128KB E
L1d 16KB P -	L1d 128KB P 64KB E
L2 512KB P shared -	L2 16MB P shared 4MB E shared
SLC Cache -	SLC Cache 24MB

Memory

Type LPDDR2	Type LPDDR5
Max Memory 4GB	Max Memory 8GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 32-bit	Bus Width 64-bit
Speed 666MT/s	Speed 6400MT/s
Bandwidth 2.7GB/s	Bandwidth 51.2GB/s
Bandwidth Calculator Channels Transfer Rate666MT/s Calculated Bandwidth 2.7GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 51.2GB/s

Power & Thermals

TDP 5W

TDP 5W

Expansion

-	PCIe PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU Adreno 302	iGPU 4-Core A16
Shaders 16	Shaders 512
Boost Clock 400MHz	Boost Clock 1.34GHz
Peak·FP32·FP16 25.6 GFLOPSFP16	Peak·FP32·FP16 1.37 TFLOPSFP16

NPU

NPU Model Hexagon QDSP6	NPU Model H15 Themis
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.06GHz
Performance -	Performance 17 TOPSFP16

Cellular

Modem Model Gobi 2000	Modem Model -
Peak Down Up to 7.2Mbps	Peak Down -
Peak Up Up to 5.8Mbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Apple
ISA AArch32	ISA AArch64
Architecture ARMv7-A	Architecture Apple Silicon 12ARMv8.6-A
Family 2 Series	Family A Series
Branding	Branding
Codename - - Cortex-A7P-Core -	Codename Crete A16Variant EverestP-Core Sawtooth E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Jul 1, 2013	Release Date Mar 4, 2025

Fabrication

Foundry Samsung	Foundry TSMC
Fabrication Node 45nm	Fabrication Node N4P
Die Size -	Die Size 115mm²
Transistor Count -	Transistor Count 16 Billion
Transistor Density -	Transistor Density 139 MTr/mm²

Images

No images available

No images available

Used In

Tablets -

Tablets iPad 11(A16, Early 2025)

Competitors

QualcommSnapdragon 200 (MSM8212) vs CPU AppleA18 Pro (Neo) QualcommSnapdragon 200 (MSM8212) vs CPU AppleA19 (17e) QualcommSnapdragon 200 (MSM8212) vs CPU AppleA19 Show 12 more

AppleA16 (iPad) vs CPU AppleA17 Pro (iPad) AppleA16 (iPad) vs CPU AppleA17 Pro AppleA16 (iPad) vs CPU AppleA18 (16e) Show 12 more