Qualcomm Snapdragon 410E vs Intel U300L Full Specs

Summary

4 Cores 4 Threads 1.2GHz	5 Cores(1P+4E) 6 Threads(2P+4E) 4.4GHz
TDP -	TDP 15W
Bandwidth 4.3GB/s LPDDR2	Bandwidth 83.2GB/s DDR5·DDR4
iGPU Adreno 306	iGPU Iris Xe 48EU 1100MHz
Peak·FP32·FP16 43.2 GFLOPSFP16	Peak·FP32·FP16 1.69 TFLOPSFP16
Socket -	Socket LGA 1700

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Snapdragon 410E-

-

U300L1,999

x1

Show Top Score

Core Config

4 Cores 4P -	5 Cores 1P 4E
4 Threads 4P -	6 Threads 2P 4E

Clocks

Base Clock 1.2GHz	Base Clock 4.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 32KB P 64KB E
L1d 32KB P -	L1d 48KB P 32KB E
L2 512KB P shared -	L2 1.25MB P - 2MB E shared
L3 -	L3 8MB

Memory

Type LPDDR2	Type DDR5·DDR4
Max Memory 4GB	Max Memory 96GB
ECC No	ECC No
Channels 1	Channels 2
Bus Width 32-bit	Bus Width 128-bit
Speed 1066MT/s	Speed 5200MT/s
Bandwidth 4.3GB/s	Bandwidth 83.2GB/s
Bandwidth Calculator Channels Transfer Rate1066MT/s Calculated Bandwidth 4.3GB/s	Bandwidth Calculator Channels Transfer Rate5200MT/s Calculated Bandwidth 83.2GB/s

Power & Thermals

TDP -	TDP 15W
cTDP-down -	cTDP-down 12W
cTDP-up -	cTDP-up 28W
Peak Power -	Peak Power 55W
Max Operating Temp -	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type -	Bus Type DMI
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 16GB/s

Expansion

-	PCIe PCIe 5.0 x16 63GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU Adreno 306	iGPU Iris Xe 48EU 1100MHz
Shaders 24	Shaders 384
Boost Clock 450MHz	Boost Clock 1.1GHz
Peak·FP32·FP16 43.2 GFLOPSFP16	Peak·FP32·FP16 1.69 TFLOPSFP16

NPU

NPU Model Hexagon QDSP6 V5	NPU Model DL Boost
NPU Clock 691MHz	NPU Clock -

Chip

Manufacturer Qualcomm	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture ARMv8.0-A	Architecture Raptor Lake
Family 4 Series	Family Processor
Branding	Branding
Codename - - Cortex-A53P-Core -	Codename Raptor Lake-U Raptor Lake-2P-8EVariant Golden CoveP-Core GracemontE-Core
Market Segment Embedded	Market Segment Embedded
Release Date Sep 9, 2014	Release Date Apr 8, 2024

Fabrication

Foundry Samsung	Foundry Intel
Fabrication Node 28nm LP	Fabrication Node Intel 7
Die Size -	Die Size 161mm²
Transistor Count -	Transistor Count 11.9 Billion
Transistor Density -	Transistor Density 74 MTr/mm²

Images

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Competitors

QualcommSnapdragon 410E vs CPU IntelU303L QualcommSnapdragon 410E vs CPU IntelU301L QualcommSnapdragon 410E vs CPU IntelU302L

IntelU300L vs CPU IntelU301L IntelU300L vs CPU IntelU303L IntelU300L vs CPU IntelU302L Show 12 more