CPUs

Qualcomm Snapdragon 439 vs Samsung Exynos 9810 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2GHz
8 Cores(4P+4E)
8 Threads(4P+4E)
2.9GHz
TDP
5W
TDP
5W
Bandwidth
6.4GB/s
LPDDR3
Bandwidth
29.9GB/s
LPDDR4X
iGPU
iGPU
··
86.4 GFLOPSFP16
··
494.2 GFLOPSFP16

8 Cores
4P
4E
8 Cores
4P
4E
8 Threads
4P
4E
8 Threads
4P
4E

Base Clock
2GHz
Base Clock
2.9GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
16KB E
L1i
-
L1d
32KB P
16KB E
L1d
-
L2
1MB P shared
1MB E shared
L2
-
-
-

Type
LPDDR3
Type
LPDDR4X
Max Memory
8GB
Max Memory
-
ECC
No
ECC
No
Channels
1
Channels
4
Bus Width
32-bit
Bus Width
64-bit
Speed
1600MT/s
Speed
3733MT/s
Bandwidth
6.4GB/s
Bandwidth
29.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
6.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
29.9GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
48
Shaders
216
Boost Clock
450MHz
Boost Clock
572MHz
··
86.4 GFLOPSFP16
··
494.2 GFLOPSFP16

NPU Model
Hexagon 536
NPU Model
-

Modem Model
X6
Modem Model
Shannon 360
Peak Down
Up to 150Mbps
Peak Down
Up to 1.2Gbps
Peak Up
Up to 75Mbps
Peak Up
Up to 200Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
Family
-
Branding
Snapdragon  branding
Branding
Exynos 9810  branding
Codename
-
Cortex-A53P-Core
Cortex-A53E-Core
Codename
Exynos 9810Variant
Exynos M3 - MeerkatP-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Jun 26, 2018
Release Date
Jan 1, 2018

Foundry
Samsung
Foundry
Samsung
Fabrication Node
28nm LP
Fabrication Node
10LPP
Die Size
-
Die Size
119mm²