Qualcomm Snapdragon 662 vs Apple M3 (8C9G-FL) Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 4.05GHz
TDP 5W	TDP 15W
Bandwidth 14.9GB/s LPDDR4X	Bandwidth 102.4GB/s LPDDR5
iGPU Adreno 610	iGPU 9-Core M3-FL
Peak·FP32·FP16 486.4 GFLOPSFP16	Peak·FP32·FP16 3.08 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 662331

x1

M3 (8C9G-FL)3,130

x9.46

Show Top Score

Core Config

8 Cores 4P 4E	8 Cores 4P 4E
8 Threads 4P 4E	8 Threads 4P 4E

Clocks

Base Clock 2GHz	Base Clock 4.05GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 16KB E	L1i 192KB P 128KB E
L1d 32KB P 16KB E	L1d 128KB P 64KB E
L2 2MB P shared 1MB E shared	L2 16MB P shared 4MB E shared
SLC Cache -	SLC Cache 8MB

Memory

Type LPDDR4X	Type LPDDR5
Max Memory 8GB	Max Memory 24GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 32-bit	Bus Width 128-bit
Speed 3733MT/s	Speed 6400MT/s
Bandwidth 14.9GB/s	Bandwidth 102.4GB/s
Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 14.9GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s

Power & Thermals

TDP 5W	TDP 15W
Max Operating Temp -	Max Operating Temp 100°C Max

Expansion

-	PCIe PCIe 4.0 x6 11.8GB/sBandwidth

iGPU

iGPU Adreno 610	iGPU 9-Core M3-FL
Shaders 128	Shaders 1152
Boost Clock 950MHz	Boost Clock 1.34GHz
Peak·FP32·FP16 486.4 GFLOPSFP16	Peak·FP32·FP16 3.08 TFLOPSFP16

NPU

NPU Model Hexagon 683	NPU Model H15 Themis
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.36GHz
Performance -	Performance 18 TOPSFP16

Cellular

Modem Model X11	Modem Model -
Peak Down Up to 390Mbps	Peak Down -
Peak Up Up to 150Mbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Apple
ISA AArch64	ISA AArch64
Architecture Kryo 260ARMv8.0-A	Architecture Apple Silicon 13ARMv8.6-A
Family 6 Series	Family M Series
Branding	Branding
Codename - - Cortex-A73P-Core Cortex-A53E-Core	Codename Ibiza M3Variant EverestP-Core Sawtooth E-Core
Market Segment Smartphone	Market Segment Tablet
Release Date Jan 20, 2020	Release Date Mar 4, 2025

Fabrication

Foundry Samsung	Foundry TSMC
Fabrication Node 14LPP	Fabrication Node N3B
Die Size -	Die Size 153mm²
Transistor Count -	Transistor Count 25 Billion
Transistor Density -	Transistor Density 164 MTr/mm²

Images

No images available

No images available

Used In

Tablets Galaxy Tab A7(SD 662, Late 2020)

Tablets iPad Air 11" Gen 2(M3, Early 2025)iPad Air 13" Gen 2(M3, Early 2025)

Competitors

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