Qualcomm Snapdragon 662 vs Intel Core i3-1005G1 Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz	2 Cores 4 Threads 1.2GHz
TDP 5W	TDP 15W
Bandwidth 14.9GB/s LPDDR4X	Bandwidth 59.7GB/s LPDDR4·DDR4
iGPU Adreno 610	iGPU UHD 32EU 900MHz Gen 11
Peak·FP32·FP16 486.4 GFLOPSFP16	Peak·FP32·FP16 921.6 GFLOPSFP16
Socket -	Socket BGA 1526

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Snapdragon 662331

x1

Core i3-1005G11,304

x3.94

Show Top Score

Core Config

8 Cores 4P 4E	2 Cores 2P -
8 Threads 4P 4E	4 Threads 4P -

Clocks

Base Clock 2GHz	Base Clock 1.2GHz
Boost Clock -	Boost Clock 3.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 16KB E	L1i 32KB P -
L1d 32KB P 16KB E	L1d 48KB P -
L2 2MB P shared 1MB E shared	L2 512KB P - -
L3 -	L3 4MB

Memory

Type LPDDR4X	Type LPDDR4·DDR4
Max Memory 8GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 32-bit	Bus Width 128-bit
Speed 3733MT/s	Speed 3733MT/s
Bandwidth 14.9GB/s	Bandwidth 59.7GB/s
Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 14.9GB/s	Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 59.7GB/s

Power & Thermals

TDP 5W	TDP 15W
cTDP-down -	cTDP-down 13W
cTDP-up -	cTDP-up 25W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 2GB/s

Expansion

-	PCIe PCIe 3.0 x8 7.9GB/sBandwidth

iGPU

iGPU Adreno 610	iGPU UHD 32EU 900MHz Gen 11
Shaders 128	Shaders 256
Boost Clock 950MHz	Boost Clock 900MHz
Peak·FP32·FP16 486.4 GFLOPSFP16	Peak·FP32·FP16 921.6 GFLOPSFP16

NPU

NPU Model Hexagon 683

NPU Model GNA 1.0

Cellular

Modem Model X11	Modem Model -
Peak Down Up to 390Mbps	Peak Down -
Peak Up Up to 150Mbps	Peak Up -

Controller

Controller Model -	Controller Model 495 Series U+
Codename -	Codename Ice Lake
PCIe -	PCIe -

Chip

Manufacturer Qualcomm	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Kryo 260ARMv8.0-A	Architecture Ice Lake
Family 6 Series	Family Core 10th Gen
Branding	Branding
Codename - Cortex-A73P-Core Cortex-A53E-Core	Codename Ice Lake-U Sunny CoveP-Core -
Market Segment Smartphone	Market Segment Laptop
Release Date Jan 20, 2020	Release Date Aug 1, 2019

Fabrication

Foundry Samsung	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node 14LPP -	Fabrication Node 10nm+ 14nmPCH
Die Size -	Die Size 122mm² 54mm²PCH
Transistor Count -	Transistor Count 7 Billion
Transistor Density -	Transistor Density 57 MTr/mm²

Images

No images available

No images available

Used In

Tablets Galaxy Tab A7(SD 662, Late 2020)

Tablets Surface Pro 7(Intel 10th Gen, Late 2019)

Competitors

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