Qualcomm Snapdragon 662 vs Intel N200 Full Specs
8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz | 4 Cores 4 Threads 1GHz |
TDP 5W | TDP 6W |
Bandwidth 14.9GB/s LPDDR4X | Bandwidth 38.4GB/s ·· |
iGPU | iGPU |
·· 486.4 GFLOPSFP16 | ·· 768 GFLOPSFP16 |
Socket - | Socket |
8 Cores 4P 4E | 4 Cores 4P - |
8 Threads 4P 4E | 4 Threads 4P - |
Base Clock 2GHz | Base Clock 1GHz |
Boost Clock - | Boost Clock 3.7GHz |
Overclocking Locked | Overclocking Locked |
L1i 32KB P 16KB E | L1i 64KB P - |
L1d 32KB P 16KB E | L1d 32KB P - |
L2 2MB P shared 1MB E shared | L2 2MB P shared - |
L3 - | L3 6MB |
Type LPDDR4X | Type ·· |
Max Memory 8GB | Max Memory 16GB |
ECC No | ECC No |
Channels 2 | Channels 1 |
Bus Width 32-bit | Bus Width 64-bit |
Speed 3733MT/s | Speed 4800MT/s |
Bandwidth 14.9GB/s | Bandwidth 38.4GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 14.9GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 38.4GB/s |
TDP 5W | TDP 6W |
Max Operating Temp - | Max Operating Temp 105°C Max |
- | PCIe PCIe 3.0 x98.9GB/sBandwidth |
iGPU | iGPU |
Shaders 128 | Shaders 256 |
Boost Clock 950MHz | Boost Clock 750MHz |
·· 486.4 GFLOPSFP16 | ·· 768 GFLOPSFP16 |
NPU Model Hexagon 683 | NPU Model GNA 3.0 |
Modem Model X11 | Modem Model - |
Peak Down Up to 390Mbps | Peak Down - |
Peak Up Up to 150Mbps | Peak Up - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture Kryo 260ARMv8.0-A | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename - - Cortex-A73P-Core Cortex-A53E-Core | Codename Alder Lake-N Alder Lake-8EVariant GracemontP-Core - |
Market Segment Smartphone | Market Segment Laptop |
Release Date Jan 20, 2020 | Release Date Jan 3, 2023 |
Foundry Samsung | Foundry Intel |
Fabrication Node 14LPP | Fabrication Node Intel 7 |
Die Size - | Die Size 122mm² |
Transistor Count - | Transistor Count 8.5 Billion |
Transistor Density - | Transistor Density 70 MTr/mm² |
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