CPUs

Qualcomm Snapdragon 662 vs Intel N200 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2GHz
4 Cores
4 Threads
1GHz
TDP
5W
TDP
6W
Bandwidth
14.9GB/s
LPDDR4X
Bandwidth
38.4GB/s
··
iGPU
iGPU
··
486.4 GFLOPSFP16
··
768 GFLOPSFP16
Socket
-
Socket

Snapdragon 662Snapdragon 662331
x1
N200N2001,306
x3.95

8 Cores
4P
4E
4 Cores
4P
-
8 Threads
4P
4E
4 Threads
4P
-

Base Clock
2GHz
Base Clock
1GHz
Boost Clock
-
Boost Clock
3.7GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
16KB E
L1i
64KB P
-
L1d
32KB P
16KB E
L1d
32KB P
-
L2
2MB P shared
1MB E shared
L2
2MB P shared
-
L3
-
L3
6MB

Type
LPDDR4X
Type
··
Max Memory
8GB
Max Memory
16GB
ECC
No
ECC
No
Channels
2
Channels
1
Bus Width
32-bit
Bus Width
64-bit
Speed
3733MT/s
Speed
4800MT/s
Bandwidth
14.9GB/s
Bandwidth
38.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
38.4GB/s

TDP
5W
TDP
6W
Max Operating Temp
-
Max Operating Temp
105°C Max

-
PCIe
PCIe 3.0 x9
8.9GB/sBandwidth

iGPU
iGPU
Shaders
128
Shaders
256
Boost Clock
950MHz
Boost Clock
750MHz
··
486.4 GFLOPSFP16
··
768 GFLOPSFP16

NPU Model
Hexagon 683
NPU Model
GNA 3.0

Modem Model
X11
Modem Model
-
Peak Down
Up to 390Mbps
Peak Down
-
Peak Up
Up to 150Mbps
Peak Up
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
x86-64
Architecture
Kryo 260ARMv8.0-A
Architecture
Family
Family
Branding
Snapdragon  branding
Branding
Processor 2023 branding
Codename
-
-
Cortex-A73P-Core
Cortex-A53E-Core
Codename
Alder Lake-N
Alder Lake-8EVariant
GracemontP-Core
-
Market Segment
Smartphone
Market Segment
Laptop
Release Date
Jan 20, 2020
Release Date
Jan 3, 2023

Foundry
Samsung
Foundry
Intel
Fabrication Node
14LPP
Fabrication Node
Intel 7
Die Size
-
Die Size
122mm²
Transistor Count
-
Transistor Count
8.5 Billion
Transistor Density
-
Transistor Density
70 MTr/mm²

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