Qualcomm Snapdragon 7+ Gen 3 vs Qualcomm Snapdragon 765 Full Specs
8 Cores(1P+4M+3E) 8 Threads(1P+4M+3E) 2.8GHz | 8 Cores(1P+1M+6E) 8 Threads(1P+1M+6E) 2.4GHz |
TDP - | TDP 5W |
Bandwidth 67.2GB/s LPDDR5X | Bandwidth 17.1GB/s LPDDR4X |
iGPU | iGPU |
·· 2.92 TFLOPSFP16 | ·· 1.15 TFLOPSFP16 |
Snapdragon 7+ Gen 31,913
Snapdragon 765-8 Cores 1P 4M 3E | 8 Cores 1P 1M 6E |
8 Threads 1P 4M 3E | 8 Threads 1P 1M 6E |
Base Clock 2.8GHz | Base Clock 2.4GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 64KB P 64KB M 32KB E |
L1d 64KB P 64KB M 32KB E | L1d 64KB P 64KB M 32KB E |
L2 1MB P 512KB M 128KB E | L2 512KB P 256KB M 128KB E |
SLC Cache 1MB | SLC Cache 1MB |
Type LPDDR5X | Type LPDDR4X |
Max Memory 16GB | Max Memory 16GB |
ECC No | ECC No |
Channels 4 | Channels 2 |
Bus Width 64-bit | Bus Width 32-bit |
Speed 8400MT/s | Speed 4266MT/s |
Bandwidth 67.2GB/s | Bandwidth 17.1GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 67.2GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 17.1GB/s |
TDP - | TDP 5W |
iGPU | iGPU |
Shaders 768 | Shaders 384 |
Boost Clock 950MHz | Boost Clock 750MHz |
·· 2.92 TFLOPSFP16 | ·· 1.15 TFLOPSFP16 |
NPU Model Hexagon | NPU Model Hexagon 696 |
Performance - | Performance 5.4 TOPS |
Modem Model X63 | Modem Model X52 |
Cellular 5G mmWave | Cellular 5G mmWave |
Peak Down Up to 5.0Gbps | Peak Down Up to 3.7Gbps |
Peak Up Up to 1.6Gbps | Peak Up Up to 1.6Gbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture KryoARMv9.2-A | Architecture Kryo 475ARMv8.2-A |
Family | Family |
Branding  | Branding  |
Codename Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core | Codename Cortex-A76P-Core Cortex-A76M-Core Cortex-A55E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Aug 1, 2024 | Release Date Jan 20, 2020 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N6 | Fabrication Node 7LPP |
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