Qualcomm Snapdragon 778G+ vs Qualcomm Snapdragon 7+ Gen 2 Full Specs
8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.5GHz | 8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.91GHz |
TDP 5W | TDP - |
Bandwidth 25.6GB/s LPDDR5 | Bandwidth 25.6GB/s LPDDR5 |
iGPU | iGPU |
·· 1.13 TFLOPSFP16 | ·· 2.38 TFLOPSFP16 |
Snapdragon 778G+1,008
Snapdragon 7+ Gen 21,4528 Cores 1P 3M 4E | 8 Cores 1P 3M 4E |
8 Threads 1P 3M 4E | 8 Threads 1P 3M 4E |
Base Clock 2.5GHz | Base Clock 2.91GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 64KB P 64KB M 32KB E |
L1d 64KB P 64KB M 32KB E | L1d 64KB P 64KB M 32KB E |
L2 512KB P 512KB M 128KB E | L2 512KB P 512KB M 128KB E |
SLC Cache 3MB | SLC Cache 1MB |
Type LPDDR5 | Type LPDDR5 |
Max Memory 24GB | Max Memory 16GB |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 32-bit | Bus Width 32-bit |
Speed 6400MT/s | Speed 6400MT/s |
Bandwidth 25.6GB/s | Bandwidth 25.6GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 25.6GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 25.6GB/s |
TDP 5W | TDP - |
iGPU | iGPU |
Shaders 512 | Shaders 1024 |
Boost Clock 550MHz | Boost Clock 580MHz |
·· 1.13 TFLOPSFP16 | ·· 2.38 TFLOPSFP16 |
NPU Model Hexagon 770 | NPU Model Hexagon |
Performance 12 TOPS | Performance - |
Modem Model X53 | Modem Model X62 |
Cellular 5G mmWave | Cellular 5G mmWave |
Peak Down Up to 3.7Gbps | Peak Down Up to 4.4Gbps |
Peak Up Up to 2.9Gbps | Peak Up Up to 1.6Gbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture Kryo 670ARMv8.2-A | Architecture KryoARMv9.0-A |
Family | Family |
Branding  | Branding  |
Codename Cortex-A78P-Core Cortex-A78M-Core Cortex-A55E-Core | Codename Cortex-X2P-Core Cortex-A710M-Core Cortex-A510E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Oct 5, 2021 | Release Date Mar 1, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N6 |
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