Qualcomm Snapdragon 778G vs Apple A13 Bionic Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.4GHz	6 Cores(2P+4E) 6 Threads(2P+4E) 2.67GHz
TDP 5W	TDP 5W
Bandwidth 25.6GB/s LPDDR5	Bandwidth 34.1GB/s LPDDR4X
iGPU Adreno 642L	iGPU 4-Core A13
Peak·FP32·FP16 1.13 TFLOPSFP16	Peak·FP32·FP16 629.8 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 778G954

x1

A13 Bionic1,783

x1.87

Show Top Score

Core Config

8 Cores 1P 3M 4E	6 Cores 2P - 4E
8 Threads 1P 3M 4E	6 Threads 2P - 4E

Clocks

Base Clock 2.4GHz	Base Clock 2.67GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 128KB P - 96KB E
L1d 64KB P 64KB M 32KB E	L1d 128KB P - 48KB E
L2 512KB P 512KB M 128KB E - -	L2 8MB P shared 4MB E shared
SLC Cache 3MB	SLC Cache 16MB

Memory

Type LPDDR5	Type LPDDR4X
Max Memory 24GB	Max Memory 4GB
ECC No	ECC No
Channels 2	Channels 1
Bus Width 32-bit	Bus Width 64-bit
Speed 6400MT/s	Speed 4266MT/s
Bandwidth 25.6GB/s	Bandwidth 34.1GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s

Power & Thermals

TDP 5W

TDP 5W

Expansion

-	PCIe PCIe 3.0 x5 4.9GB/sBandwidth

iGPU

iGPU Adreno 642L	iGPU 4-Core A13
Shaders 512	Shaders 256
Boost Clock 550MHz	Boost Clock 1.23GHz
Peak·FP32·FP16 1.13 TFLOPSFP16	Peak·FP32·FP16 629.8 GFLOPSFP16

NPU

NPU Model Hexagon 770	NPU Model H12 Metis
NPU Cores -	NPU Cores 8
NPU Clock -	NPU Clock 1.32GHz
Performance 12 TOPS	Performance 5.5 TOPSFP16

Cellular

Modem Model X53	Modem Model -
Cellular 5G mmWave	Cellular -
Peak Down Up to 3.7Gbps	Peak Down -
Peak Up Up to 2.9Gbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Apple
ISA AArch64	ISA AArch64
Architecture Kryo 670ARMv8.2-A	Architecture Apple Silicon 9ARMv8.4-A
Family 7 Series	Family A Series
Branding	Branding
Codename - - Cortex-A78P-Core Cortex-A78M-Core Cortex-A55E-Core	Codename Cebu A13Variant LightningP-Core - ThunderE-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date May 19, 2021	Release Date Sep 20, 2019

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node N7P
Die Size -	Die Size 98mm²
Transistor Count -	Transistor Count 8.5 Billion
Transistor Density -	Transistor Density 86 MTr/mm²

Images

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Used In

Smartphones Nothing Phone 1	Smartphones iPhone 11iPhone 11 ProiPhone 11 Pro Max Show 1 more
Tablets Galaxy Tab S7 FE(SD 778G, Mid 2021)	Tablets iPad 9(A13, Late 2021)

Competitors

CPU QualcommSnapdragon 778G vs CPU QualcommSnapdragon 7 Gen 4 CPU QualcommSnapdragon 778G vs CPU QualcommSnapdragon 7s Gen 3 CPU QualcommSnapdragon 778G vs CPU QualcommSnapdragon 7+ Gen 3 Show 12 more

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