Qualcomm Snapdragon 778G vs Intel Core i5-1230U Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.4GHz	10 Cores(2P+8E) 12 Threads(4P+8E) 1GHz
TDP 5W	TDP 9W
Bandwidth 25.6GB/s LPDDR5	Bandwidth 83.2GB/s LPDDR5·LPDDR4X
iGPU Adreno 642L	iGPU Iris Xe 80EU 900MHz
Peak·FP32·FP16 1.13 TFLOPSFP16	Peak·FP32·FP16 2.3 TFLOPSFP16
Socket -	Socket BGA 1744

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 778G954

x1

Core i5-1230U1,860

x1.95

Show Top Score

Core Config

8 Cores 1P 3M 4E	10 Cores 2P - 8E
8 Threads 1P 3M 4E	12 Threads 4P - 8E

Clocks

Base Clock 2.4GHz	Base Clock 1GHz
Boost Clock -	Boost Clock 4.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 32KB P - 64KB E
L1d 64KB P 64KB M 32KB E	L1d 48KB P - 32KB E
L2 512KB P 512KB M 128KB E -	L2 1.25MB P - - 2MB E shared
L3 -	L3 12MB
SLC Cache 3MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR5·LPDDR4X
Max Memory 24GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 32-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 5200MT/s
Bandwidth 25.6GB/s	Bandwidth 83.2GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate5200MT/s Calculated Bandwidth 83.2GB/s

Power & Thermals

TDP 5W	TDP 9W
Peak Power -	Peak Power 29W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 4GB/s

Expansion

-	PCIe PCIe 4.0 x6 11.8GB/sBandwidth

iGPU

iGPU Adreno 642L	iGPU Iris Xe 80EU 900MHz
Shaders 512	Shaders 640
Boost Clock 550MHz	Boost Clock 900MHz
Peak·FP32·FP16 1.13 TFLOPSFP16	Peak·FP32·FP16 2.3 TFLOPSFP16

NPU

NPU Model Hexagon 770	NPU Model GNA 3.0
Performance 12 TOPS	Performance -

Cellular

Modem Model X53	Modem Model -
Cellular 5G mmWave	Cellular -
Peak Down Up to 3.7Gbps	Peak Down -
Peak Up Up to 2.9Gbps	Peak Up -

Controller

Controller Model -	Controller Model 600 Series P+
Codename -	Codename Alder Lake
PCIe -	PCIe -

Chip

Manufacturer Qualcomm	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Kryo 670ARMv8.2-A	Architecture Alder Lake
Family 7 Series	Family Core 12th Gen
Branding	Branding
Codename - - Cortex-A78P-Core Cortex-A78M-Core Cortex-A55E-Core	Codename Alder Lake-P Alder Lake-2P-8EVariant Golden CoveP-Core - GracemontE-Core
Market Segment Smartphone	Market Segment Laptop
Release Date May 19, 2021	Release Date Feb 23, 2022

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node N6 -	Fabrication Node Intel 7 14nmPCH
Die Size -	Die Size 161mm² 54mm²PCH
Transistor Count -	Transistor Count 11.9 Billion
Transistor Density -	Transistor Density 74 MTr/mm²

Images

No images available

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Used In

Laptops -	Laptops XPS 13(9315, Mid 2022)Envy x360 13(Early 2022)
Smartphones Nothing Phone 1	Smartphones -
Tablets Galaxy Tab S7 FE(SD 778G, Mid 2021)	Tablets XPS 13 2-in-1 29315(Intel 12th Gen, Mid 2022)

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