Qualcomm Snapdragon 778G vs Intel Pentium Gold 6500Y Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.4GHz	2 Cores 4 Threads 1.1GHz
TDP 5W	TDP 5W
Bandwidth 25.6GB/s LPDDR5	Bandwidth 29.9GB/s LPDDR3·DDR3L
iGPU Adreno 642L	iGPU UHD 615 23EU 900MHz
Peak·FP32·FP16 1.13 TFLOPSFP16	Peak·FP32·FP16 331.2 GFLOPSFP16
Socket -	Socket BGA 1515

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 778G954

x1

Pentium Gold 6500Y996

x1.04

Show Top Score

Core Config

8 Cores 1P 3M 4E	2 Cores 2P - -
8 Threads 1P 3M 4E	4 Threads 4P - -

Clocks

Base Clock 2.4GHz	Base Clock 1.1GHz
Boost Clock -	Boost Clock 3.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 32KB P - -
L1d 64KB P 64KB M 32KB E	L1d 32KB P - -
L2 512KB P 512KB M 128KB E	L2 256KB P - -
L3 -	L3 4MB
SLC Cache 3MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR3·DDR3L
Max Memory 24GB	Max Memory 16GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 32-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 1866MT/s
Bandwidth 25.6GB/s	Bandwidth 29.9GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s

Power & Thermals

TDP 5W	TDP 5W
cTDP-down -	cTDP-down 4W
cTDP-up -	cTDP-up 7W
Max Operating Temp -	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type OPI
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 4GT/s
Bus Bandwidth -	Bus Bandwidth 2GB/s

Expansion

-	PCIe PCIe 3.0 x10 9.8GB/sBandwidth

iGPU

iGPU Adreno 642L	iGPU UHD 615 23EU 900MHz
Shaders 512	Shaders 184
Boost Clock 550MHz	Boost Clock 900MHz
Peak·FP32·FP16 1.13 TFLOPSFP16	Peak·FP32·FP16 331.2 GFLOPSFP16

NPU

NPU Model Hexagon 770	NPU Model -
Performance 12 TOPS	Performance -

Cellular

Modem Model X53	Modem Model -
Cellular 5G mmWave	Cellular -
Peak Down Up to 3.7Gbps	Peak Down -
Peak Up Up to 2.9Gbps	Peak Up -

Controller

Controller Model -	Controller Model 300 Series Y+
Codename -	Codename Amber Lake
PCIe -	PCIe -

Chip

Manufacturer Qualcomm	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Kryo 670ARMv8.2-A	Architecture Skylake
Family 7 Series	Family Pentium
Branding	Branding
Codename - - Cortex-A78P-Core Cortex-A78M-Core Cortex-A55E-Core	Codename Amber Lake-Y Amber Lake-2CVariant - - -
Market Segment Smartphone	Market Segment Laptop
Release Date May 19, 2021	Release Date Jan 3, 2021

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node N6 -	Fabrication Node 14nm++ 22nmPCH
Die Size -	Die Size 103mm² 52mm²PCH
Transistor Count -	Transistor Count 1.8 Billion
Transistor Density -	Transistor Density 17 MTr/mm²

Images

No images available

No images available

Used In

Smartphones Nothing Phone 1	Smartphones -
Tablets Galaxy Tab S7 FE(SD 778G, Mid 2021)	Tablets Surface Go 3(Amber Lake-R, Late 2021)

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