Qualcomm Snapdragon 778G vs MediaTek Dimensity 7350 Full Specs
8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.4GHz | 8 Cores(2P+6E) 8 Threads(2P+6E) 3GHz |
TDP 5W | TDP - |
Bandwidth 25.6GB/s LPDDR5 | Bandwidth 51.2GB/s · |
iGPU | iGPU |
·· 1.13 TFLOPSFP16 | ·· 1.33 TFLOPSFP16 |
Snapdragon 778G954
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Dimensity 73501,1958 Cores 1P 3M 4E | 8 Cores 2P - 6E |
8 Threads 1P 3M 4E | 8 Threads 2P - 6E |
Base Clock 2.4GHz | Base Clock 3GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 64KB P - 32KB E |
L1d 64KB P 64KB M 32KB E | L1d 64KB P - 32KB E |
L2 512KB P 512KB M 128KB E | L2 1MB P - 128KB E |
L3 - | L3 4MB |
SLC Cache 3MB | SLC Cache - |
Type LPDDR5 | Type · |
Max Memory 24GB | Max Memory - |
ECC No | ECC No |
Channels 2 | Channels 4 |
Bus Width 32-bit | Bus Width 64-bit |
Speed 6400MT/s | Speed 6400MT/s |
Bandwidth 25.6GB/s | Bandwidth 51.2GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 25.6GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 51.2GB/s |
TDP 5W | TDP - |
iGPU | iGPU |
Shaders 512 | Shaders 256 |
Boost Clock 550MHz | Boost Clock 1.3GHz |
·· 1.13 TFLOPSFP16 | ·· 1.33 TFLOPSFP16 |
NPU Model Hexagon 770 | NPU Model MediaTek APU 657 |
Performance 12 TOPS | Performance - |
Modem Model X53 | Modem Model MT 5G R2 |
Cellular 5G mmWave | Cellular 5G |
Peak Down Up to 3.7Gbps | Peak Down Up to 4.7Gbps |
Peak Up Up to 2.9Gbps | Peak Up Up to 900Mbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture Kryo 670ARMv8.2-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename Cortex-A78P-Core Cortex-A78M-Core Cortex-A55E-Core | Codename Cortex-A715P-Core - Cortex-A510E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date May 19, 2021 | Release Date Jul 1, 2024 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N4P |
No images available
No images available
Smartphones | Smartphones |
Tablets | Tablets - |