Qualcomm Snapdragon 7c Gen 2 vs Intel Core Ultra 5 226V Full Specs

Summary

8 Cores(2P+6E) 8 Threads(2P+6E) 2.55GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2.1GHz
TDP -	TDP 17W
Bandwidth 17.1GB/s LPDDR4X	Bandwidth 136.5GB/s LPDDR5X
iGPU Adreno 618	iGPU Arc 130V 1850MHz
Peak·FP32·FP16 844.8 GFLOPSFP16	Peak·FP32·FP16 106.1 TOPSINT4 Tensor
Socket -	Socket BGA 2833

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 7c Gen 2-

-

Core Ultra 5 226V2,543

x1

Show Top Score

Core Config

8 Cores 2P 6E	8 Cores 4P 4E
8 Threads 2P 6E	8 Threads 4P 4E

Clocks

Base Clock 2.55GHz	Base Clock 2.1GHz
Boost Clock -	Boost Clock 4.5GHz
Overclocking Locked	Overclocking Locked

Cache

L0i -	L0i 64KB
L0d -	L0d 48KB
L1i 64KB P 32KB E	L1i - 64KB E
L1d 64KB P 32KB E	L1d 192KB P 32KB E
L2 512KB P 128KB E -	L2 2.5MB P - 4MB E shared
L3 -	L3 8MB
SLC Cache 1MB	SLC Cache -

Memory

Type LPDDR4X	Type LPDDR5X
Max Memory 16GB	Max Memory 16GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 32-bit	Bus Width 128-bit
Speed 4266MT/s	Speed 8533MT/s
Bandwidth 17.1GB/s	Bandwidth 136.5GB/s
Bandwidth Calculator Channels Transfer Rate4266MT/s UC·Spec·OC 17.1GB/s	Bandwidth Calculator Channels Transfer Rate8533MT/s UC·Spec·OC 136.5GB/s

Power & Thermals

TDP -	TDP 17W
cTDP-down -	cTDP-down 8W
Peak Power -	Peak Power 37W
Max Operating Temp -	Max Operating Temp 100°C Max

Expansion

-	PCIe PCIe 5.0 x4 15.8GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU Adreno 618	iGPU Arc 130V 1850MHz
Shaders 256	Shaders 896
Boost Clock 825MHz	Boost Clock 1.85GHz
Peak·FP32·FP16 844.8 GFLOPSFP16	Peak·FP32·FP16 106.1 TOPSINT4 Tensor

NPU

NPU Model Hexagon 692	NPU Model AI Boost 4
NPU Cores -	NPU Cores 5
Performance 5 TOPS	Performance 40 TOPSINT8

Cellular

Modem Model X15	Modem Model -
Peak Down Up to 800Mbps	Peak Down -
Peak Up Up to 150Mbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Kryo 468ARMv8.2-A	Architecture Lunar Lake
Family 7 Series	Family Core Ultra Series 2
Branding	Branding
Codename - - Cortex-A76P-Core Cortex-A55E-Core	Codename Lunar Lake-V Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date May 19, 2021	Release Date Sep 3, 2024
Part Number SC7180P	Part Number QQ8076606107, QQ8076606108
S-Spec -	S-Spec SRPMQ, SRPMR
	Official specs

Fabrication

Foundry Samsung	Foundry TSMC
Other Foundries -	Other Foundries IntelFIB TSMCIO
Fabrication Node 8LPP - -	Fabrication Node N3B 22nmFIB N6IO
Die Size -	Die Size 140mm² 46mm²IO

Images