Qualcomm Snapdragon 8 Elite Galaxy vs Qualcomm Snapdragon 870 Full Specs

Summary

8 Cores(2P+6E) 8 Threads(2P+6E) 4.47GHz	8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.2GHz
TDP 5W	TDP 5W
Bandwidth 84.8GB/s LPDDR5X	Bandwidth 44GB/s LPDDR5·LPDDR4X
iGPU Adreno 830	iGPU Adreno 650+
Peak·FP32·FP16 6.76 TFLOPSFP16	Peak·FP32·FP16 2.06 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 8 Elite Galaxy3,220

x2.74

Snapdragon 8701,176

x1

Show Top Score

Core Config

8 Cores 2P - 6E	8 Cores 1P 3M 4E
8 Threads 2P - 6E	8 Threads 1P 3M 4E

Clocks

Base Clock 4.47GHz	Base Clock 3.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 128KB P - 64KB E	L1i 64KB P 64KB M 32KB E
L1d 64KB P - 64KB E	L1d 64KB P 64KB M 32KB E
L2 12MB P shared 12MB E shared	L2 512KB P 256KB M 128KB E - -
L3 -	L3 4MB
SLC Cache 8MB	SLC Cache 3MB

Memory

Type LPDDR5X	Type LPDDR5·LPDDR4X
Max Memory 24GB	Max Memory 24GB
ECC No	ECC No
Channels 4	Channels 4
Bus Width 64-bit	Bus Width 64-bit
Speed 10600MT/s	Speed 5500MT/s
Bandwidth 84.8GB/s	Bandwidth 44GB/s
Bandwidth Calculator Channels Transfer Rate10600MT/s Calculated Bandwidth 84.8GB/s	Bandwidth Calculator Channels Transfer Rate5500MT/s Calculated Bandwidth 44GB/s

Power & Thermals

TDP 5W	TDP 5W
Peak Power 17W	Peak Power -

iGPU

iGPU Adreno 830	iGPU Adreno 650+
Shaders 1536	Shaders 768
Boost Clock 1.1GHz	Boost Clock 670MHz
Peak·FP32·FP16 6.76 TFLOPSFP16	Peak·FP32·FP16 2.06 TFLOPSFP16

NPU

NPU Model Hexagon	NPU Model Hexagon 698
NPU Clock -	NPU Clock 576MHz
Performance 45 TOPSINT8	Performance 15 TOPS

Cellular

Modem Model X80	Modem Model X55
Cellular 5G mmWave	Cellular 5G mmWave
Peak Down Up to 10.0Gbps	Peak Down Up to 7.5Gbps
Peak Up Up to 3.5Gbps	Peak Up Up to 3.0Gbps

Chip

Manufacturer Qualcomm	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Oryon 2ARMv8.7-A	Architecture Kryo 585ARMv8.2-A
Family 8 Series	Family 8 Series
Branding	Branding
Codename Snapdragon 8 EliteVariant Phoenix-PP-Core - Phoenix-EE-Core	Codename - Cortex-A77P-Core Cortex-A77M-Core Cortex-A55E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Oct 21, 2024	Release Date Mar 25, 2021

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3E	Fabrication Node N7P
Die Size 124mm²	Die Size 84mm²
Transistor Count -	Transistor Count 10.3 Billion
Transistor Density -	Transistor Density 123 MTr/mm²

Images

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Used In

Smartphones Galaxy S25Galaxy S25+Galaxy S25 Ultra

Smartphones -

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