Qualcomm Snapdragon 8 Elite vs Qualcomm Snapdragon 800 (MSM8274AC v3) Full Specs

Summary

8 Cores(2P+6E) 8 Threads(2P+6E) 4.32GHz	4 Cores 4 Threads 2.45GHz
TDP 5W	TDP 5W
Bandwidth 84.8GB/s LPDDR5X	Bandwidth 14.9GB/s LPDDR3
iGPU Adreno 830	iGPU Adreno 330+
Peak·FP32·FP16 6.76 TFLOPSFP16	Peak·FP32·FP16 295.9 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 8 Elite3,180

x1

Snapdragon 800 (MSM8274AC v3)-

-

Show Top Score

Core Config

8 Cores 2P 6E	4 Cores 4P -
8 Threads 2P 6E	4 Threads 4P -

Clocks

Base Clock 4.32GHz	Base Clock 2.45GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 128KB P 64KB E	L1i 16KB P -
L1d 64KB P 64KB E	L1d 16KB P -
L2 12MB P shared 12MB E shared	L2 2MB P shared -
SLC Cache 8MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR3
Max Memory 24GB	Max Memory 8GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 64-bit	Bus Width 64-bit
Speed 10600MT/s	Speed 1866MT/s
Bandwidth 84.8GB/s	Bandwidth 14.9GB/s
Bandwidth Calculator Channels Transfer Rate10600MT/s Calculated Bandwidth 84.8GB/s	Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 14.9GB/s

Power & Thermals

TDP 5W	TDP 5W
Peak Power 17W	Peak Power -

iGPU

iGPU Adreno 830	iGPU Adreno 330+
Shaders 1536	Shaders 128
Boost Clock 1.1GHz	Boost Clock 578MHz
Peak·FP32·FP16 6.76 TFLOPSFP16	Peak·FP32·FP16 295.9 GFLOPSFP16

NPU

NPU Model Hexagon	NPU Model Hexagon QDSP6 V5
NPU Clock -	NPU Clock 600MHz
Performance 45 TOPSINT8	Performance -

Cellular

Modem Model X80	Modem Model Gobi 2000
Cellular 5G mmWave	Cellular LTE
Peak Down Up to 10.0Gbps	Peak Down Up to 7.2Mbps
Peak Up Up to 3.5Gbps	Peak Up Up to 5.8Mbps

Chip

Manufacturer Qualcomm	Manufacturer Qualcomm
ISA AArch64	ISA AArch32
Architecture Oryon 2ARMv8.7-A	Architecture Krait 400ARMv7-A
Family 8 Series	Family 8 Series
Branding	Branding
Codename Snapdragon 8 EliteVariant Phoenix-PP-Core Phoenix-EE-Core	Codename - Cortex-A15P-Core -
Market Segment Smartphone	Market Segment Smartphone
Release Date Oct 21, 2024	Release Date Jun 1, 2014

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3E	Fabrication Node 28nm HPM
Die Size 124mm²	Die Size -

Images

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Used In

Smartphones OnePlus 13

Smartphones -

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