Qualcomm Snapdragon 808+ vs Qualcomm Snapdragon 8s Gen 3 Full Specs
8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz | 8 Cores(1P+4M+3E) 8 Threads(1P+4M+3E) 3GHz |
TDP 5W | TDP 5W |
Bandwidth 25.6GB/s LPDDR4 | Bandwidth 67.2GB/s LPDDR5X |
iGPU | iGPU |
·· 483.8 GFLOPSFP16 | ·· 3.38 TFLOPSFP16 |
Snapdragon 808+-
Snapdragon 8s Gen 32,0198 Cores 4P - 4E | 8 Cores 1P 4M 3E |
8 Threads 4P - 4E | 8 Threads 1P 4M 3E |
Base Clock 2GHz | Base Clock 3GHz |
Overclocking Locked | Overclocking Locked |
L1i 32KB P - 16KB E | L1i 64KB P 64KB M 32KB E |
L1d 32KB P - 16KB E | L1d 64KB P 64KB M 32KB E |
L2 512KB P shared 1MB E shared | L2 1MB P 512KB M 128KB E - - |
L3 - | L3 8MB |
SLC Cache - | SLC Cache 4MB |
Type LPDDR4 | Type LPDDR5X |
Max Memory 8GB | Max Memory 24GB |
ECC No | ECC No |
Channels 2 | Channels 4 |
Bus Width 64-bit | Bus Width 64-bit |
Speed 3200MT/s | Speed 8400MT/s |
Bandwidth 25.6GB/s | Bandwidth 67.2GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 25.6GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 67.2GB/s |
TDP 5W | TDP 5W |
iGPU | iGPU |
Shaders 192 | Shaders 768 |
Boost Clock 630MHz | Boost Clock 1.1GHz |
·· 483.8 GFLOPSFP16 | ·· 3.38 TFLOPSFP16 |
NPU Model Hexagon V56 | NPU Model Hexagon |
NPU Clock 800MHz | NPU Clock - |
Performance - | Performance 45 TOPSINT8 |
Modem Model X10 | Modem Model X70 |
Cellular LTE | Cellular 5G mmWave |
Peak Down Up to 450Mbps | Peak Down Up to 10.0Gbps |
Peak Up Up to 50Mbps | Peak Up Up to 3.5Gbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture | Architecture KryoARMv9.2-A |
Family | Family |
Branding  | Branding  |
Codename - Cortex-A57P-Core - Cortex-A53E-Core | Codename Snapdragon 8s Gen 3Variant Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Jul 1, 2015 | Release Date Mar 1, 2024 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 28nm LP | Fabrication Node N4P |
Die Size - | Die Size 90mm² |
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