Qualcomm Snapdragon 835 vs Qualcomm Snapdragon 8s Gen 3 Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 2.45GHz	8 Cores(1P+4M+3E) 8 Threads(1P+4M+3E) 3GHz
TDP 5W	TDP 5W
Bandwidth 29.9GB/s LPDDR4X	Bandwidth 67.2GB/s LPDDR5X
iGPU Adreno 540	iGPU Adreno 735
Peak·FP32·FP16 727 GFLOPSFP16	Peak·FP32·FP16 3.38 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 835393

x1

Snapdragon 8s Gen 32,019

x5.14

Show Top Score

Core Config

8 Cores 4P - 4E	8 Cores 1P 4M 3E
8 Threads 4P - 4E	8 Threads 1P 4M 3E

Clocks

Base Clock 2.45GHz	Base Clock 3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P - 32KB E	L1i 64KB P 64KB M 32KB E
L1d 32KB P - 32KB E	L1d 64KB P 64KB M 32KB E
L2 2MB P shared 1MB E shared	L2 1MB P 512KB M 128KB E - -
L3 -	L3 8MB
SLC Cache -	SLC Cache 4MB

Memory

Type LPDDR4X	Type LPDDR5X
Max Memory 16GB	Max Memory 24GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 64-bit	Bus Width 64-bit
Speed 3733MT/s	Speed 8400MT/s
Bandwidth 29.9GB/s	Bandwidth 67.2GB/s
Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 29.9GB/s	Bandwidth Calculator Channels Transfer Rate8400MT/s Calculated Bandwidth 67.2GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Adreno 540	iGPU Adreno 735
Shaders 256	Shaders 768
Boost Clock 710MHz	Boost Clock 1.1GHz
Peak·FP32·FP16 727 GFLOPSFP16	Peak·FP32·FP16 3.38 TFLOPSFP16

NPU

NPU Model Hexagon 682	NPU Model Hexagon
Performance -	Performance 45 TOPSINT8

Cellular

Modem Model X16	Modem Model X70
Cellular LTE	Cellular 5G mmWave
Peak Down Up to 1.0Gbps	Peak Down Up to 10.0Gbps
Peak Up Up to 150Mbps	Peak Up Up to 3.5Gbps

Chip

Manufacturer Qualcomm	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Kryo 280ARMv8.0-A	Architecture KryoARMv9.2-A
Family 8 Series	Family 8 Series
Branding	Branding
Codename - Cortex-A73P-Core - Cortex-A72E-Core	Codename Snapdragon 8s Gen 3Variant Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date May 9, 2017	Release Date Mar 1, 2024

Fabrication

Foundry Samsung	Foundry TSMC
Fabrication Node 10LPE	Fabrication Node N4P
Die Size -	Die Size 90mm²

Images

No images available

No images available

Used In

Smartphones Pixel 2Pixel 2 XL

Smartphones -

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