CPUs

Qualcomm Snapdragon 845 vs MediaTek Dimensity 720 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2.8GHz
8 Cores(2P+6E)
8 Threads(2P+6E)
2GHz
TDP
5W
TDP
-
Bandwidth
29.9GB/s
LPDDR4X
Bandwidth
17.1GB/s
LPDDR4X
iGPU
iGPU
··
1.45 TFLOPSFP16
··
326.4 GFLOPSFP16

Snapdragon 845Snapdragon 845493
x1
Dimensity 720Dimensity 720-
-

8 Cores
4P
4E
8 Cores
2P
6E
8 Threads
4P
4E
8 Threads
2P
6E

Base Clock
2.8GHz
Base Clock
2GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
32KB E
L1i
64KB P
32KB E
L1d
32KB P
32KB E
L1d
64KB P
32KB E
L2
256KB P
128KB E
L2
512KB P
128KB E
L3
2MB
L3
-
SLC Cache
3MB
SLC Cache
-

Type
LPDDR4X
Type
LPDDR4X
Max Memory
16GB
Max Memory
-
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
32-bit
Speed
3733MT/s
Speed
4266MT/s
Bandwidth
29.9GB/s
Bandwidth
17.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
29.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
17.1GB/s

TDP
5W
TDP
-

iGPU
iGPU
Shaders
512
Shaders
96
Boost Clock
710MHz
Boost Clock
850MHz
··
1.45 TFLOPSFP16
··
326.4 GFLOPSFP16

NPU Model
Hexagon 685
NPU Model
-
Performance
3 TOPS
Performance
-

Modem Model
X20
Modem Model
MT 5G
Cellular
LTE
Cellular
5G
Peak Down
Up to 1.2Gbps
Peak Down
Up to 2.8Gbps
Peak Up
Up to 150Mbps
Peak Up
Up to 900Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Kryo 385ARMv8.2-A
Architecture
Family
Family
Branding
Snapdragon 8 Series  branding
Branding
Dimensity  branding
Codename
Cortex-A75P-Core
Cortex-A55E-Core
Codename
Cortex-A76P-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Dec 6, 2017
Release Date
Aug 1, 2020

Foundry
Samsung
Foundry
TSMC
Fabrication Node
10LPP
Fabrication Node
N7

No images available
No images available

Smartphones
Smartphones