Qualcomm Snapdragon 855 vs Samsung Exynos 2200 Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.84GHz	8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.8GHz
TDP 5W	TDP 5W
Bandwidth 34.1GB/s LPDDR4X	Bandwidth 51.2GB/s LPDDR5
iGPU Adreno 640	iGPU Xclipse 920
Peak·FP32·FP16 1.8 TFLOPSFP16	Peak·FP32·FP16 499.2 GFLOPSFP32

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 855901

x1

Exynos 22001,582

x1.76

Show Top Score

Core Config

8 Cores 1P 3M 4E	8 Cores 1P 3M 4E
8 Threads 1P 3M 4E	8 Threads 1P 3M 4E

Clocks

Base Clock 2.84GHz	Base Clock 2.8GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i -
L1d 64KB P 64KB M 32KB E	L1d -
L2 512KB P 256KB M 128KB E	L2 -
L3 2MB	L3 -
SLC Cache 3MB	SLC Cache -

Memory

Type LPDDR4X	Type LPDDR5
Max Memory 16GB	Max Memory 24GB
ECC No	ECC No
Channels 4	Channels 4
Bus Width 64-bit	Bus Width 64-bit
Speed 4266MT/s	Speed 6400MT/s
Bandwidth 34.1GB/s	Bandwidth 51.2GB/s
Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 51.2GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Adreno 640	iGPU Xclipse 920
Shaders 768	Shaders 192
Boost Clock 585MHz	Boost Clock 1.3GHz
Peak·FP32·FP16 1.8 TFLOPSFP16	Peak·FP32·FP16 499.2 GFLOPSFP32

NPU

NPU Model Hexagon 690	NPU Model -
NPU Cores -	NPU Cores 2
NPU Clock 576MHz	NPU Clock -
Performance 7 TOPS	Performance -

Cellular

Modem Model X24	Modem Model Shannon 7350/3670
Cellular LTE	Cellular 5G
Peak Down Up to 2.0Gbps	Peak Down Up to 7.3Gbps
Peak Up Up to 316Mbps	Peak Up Up to 3.7Gbps

Chip

Manufacturer Qualcomm	Manufacturer Samsung
ISA AArch64	ISA AArch64
Architecture Kryo 485ARMv8.2-A	Architecture ARMv9.0-A
Family 8 Series	Family -
Branding	Branding
Codename Snapdragon 855Variant Cortex-A76P-Core Cortex-A76M-Core Cortex-A55E-Core	Codename Exynos 2200Variant Cortex-X2P-Core Cortex-A710M-Core Cortex-A510E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Oct 22, 2019	Release Date Jan 1, 2022

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N7	Fabrication Node 4LPE
Die Size 77mm²	Die Size 100mm²

Images

No images available

No images available

Used In

Smartphones Pixel 4Pixel 4 XL

Smartphones Galaxy S23 FE Exynos

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