CPUs

Qualcomm Snapdragon 8cx Gen 2 vs Intel Core i5-1240P Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
3.15GHz
12 Cores(4P+8E)
16 Threads(8P+8E)
1.7GHz
TDP
-
TDP
28W
Bandwidth
68.3GB/s
LPDDR4X
Bandwidth
83.2GB/s
···
iGPU
iGPU
··
4.18 TFLOPSFP16
··
3.33 TFLOPSFP16
Socket
-
Socket

Snapdragon 8cx Gen 2Snapdragon 8cx Gen 2-
-
Core i5-1240PCore i5-1240P2,000
x1

8 Cores
4P
4E
12 Cores
4P
8E
8 Threads
4P
4E
16 Threads
8P
8E

Base Clock
3.15GHz
Base Clock
1.7GHz
Boost Clock
-
Boost Clock
4.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
32KB E
L1i
32KB P
64KB E
L1d
64KB P
32KB E
L1d
48KB P
32KB E
L2
512KB P
128KB E
-
L2
1.25MB P
-
2MB E shared
L3
2MB
L3
12MB
SLC Cache
3MB
SLC Cache
-

Type
LPDDR4X
Type
···
Max Memory
16GB
Max Memory
64GB
ECC
No
ECC
No
Channels
8
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
4266MT/s
Speed
5200MT/s
Bandwidth
68.3GB/s
Bandwidth
83.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
68.3GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
83.2GB/s

TDP
-
TDP
28W
Peak Power
-
Peak Power
64W
Max Operating Temp
-
Max Operating Temp
100°C Max

Bus Type
-
Bus Type
OPI
Bus Config
-
Bus Config
8 lanes
Bus Speed
-
Bus Speed
4GT/s
Bus Bandwidth
-
Bus Bandwidth
4GB/s

-
PCIe
PCIe 4.0 x12
23.6GB/sBandwidth

iGPU
iGPU
Shaders
1536
Shaders
640
Boost Clock
680MHz
Boost Clock
1.3GHz
··
4.18 TFLOPSFP16
··
3.33 TFLOPSFP16

NPU Model
Hexagon 690
NPU Model
GNA 3.0
Performance
9 TOPS
Performance
-

Modem Model
X55
Modem Model
-
Cellular
5G mmWave
Cellular
-
Peak Down
Up to 7.5Gbps
Peak Down
-
Peak Up
Up to 3.0Gbps
Peak Up
-

Controller Model
-
Controller Model
600 Series P+
Codename
-
Codename
Alder Lake
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
x86-64
Architecture
Kryo 495ARMv8.2-A
Architecture
Family
Family
Branding
Snapdragon 8cx Gen 2  branding
Branding
Core i5 2020 branding
Codename
-
Snapdragon 8cx Gen 2Variant
Cortex-A76P-Core
Cortex-A55E-Core
Codename
Alder Lake-H
Alder Lake-6P-8EVariant
Golden CoveP-Core
GracemontE-Core
Market Segment
Laptop
Market Segment
Laptop
Release Date
Aug 30, 2020
Release Date
Feb 23, 2022

Foundry
TSMC
Foundry
Intel
Other Foundries
-
Other Foundries
IntelPCH
Fabrication Node
N7
-
Fabrication Node
Intel 7
14nmPCH
Die Size
-
Die Size
208mm²
54mm²PCH
Transistor Count
-
Transistor Count
15.2 Billion
Transistor Density
-
Transistor Density
73 MTr/mm²

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