Qualcomm Snapdragon 8cx Gen 2 vs Intel Core i7-12800HX Full Specs
8 Cores(4P+4E) 8 Threads(4P+4E) 3.15GHz | 16 Cores(8P+8E) 24 Threads(16P+8E) 2GHz |
TDP - | TDP 55W |
Bandwidth 68.3GB/s LPDDR4X | Bandwidth 76.8GB/s · |
iGPU | iGPU |
·· 4.18 TFLOPSFP16 | ·· 1.49 TFLOPSFP16 |
Socket - | Socket |
Snapdragon 8cx Gen 2-
Core i7-12800HX2,3218 Cores 4P 4E | 16 Cores 8P 8E |
8 Threads 4P 4E | 24 Threads 16P 8E |
Base Clock 3.15GHz | Base Clock 2GHz |
Boost Clock - | Boost Clock 4.8GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 32KB E | L1i 32KB P 64KB E |
L1d 64KB P 32KB E | L1d 48KB P 32KB E |
L2 512KB P 128KB E - | L2 1.25MB P - 4MB E shared |
L3 2MB | L3 25MB |
SLC Cache 3MB | SLC Cache - |
Type LPDDR4X | Type · |
Max Memory 16GB | Max Memory 128GB |
ECC No | ECC No |
Channels 8 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 4266MT/s | Speed 4800MT/s |
Bandwidth 68.3GB/s | Bandwidth 76.8GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 68.3GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 76.8GB/s |
TDP - | TDP 55W |
Peak Power - | Peak Power 157W |
Max Operating Temp - | Max Operating Temp 100°C Max |
Bus Type - | Bus Type DMI |
Bus Config - | Bus Config 8 lanes |
Bus Speed - | Bus Speed 16GT/s |
Bus Bandwidth - | Bus Bandwidth 16GB/s |
- | PCIe PCIe 5.0 x1663GB/sBandwidth |
- | PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth |
iGPU | iGPU |
Shaders 1536 | Shaders 256 |
Boost Clock 680MHz | Boost Clock 1.45GHz |
·· 4.18 TFLOPSFP16 | ·· 1.49 TFLOPSFP16 |
NPU Model Hexagon 690 | NPU Model GNA 3.0 |
Performance 9 TOPS | Performance - |
Modem Model X55 | Modem Model - |
Cellular 5G mmWave | Cellular - |
Peak Down Up to 7.5Gbps | Peak Down - |
Peak Up Up to 3.0Gbps | Peak Up - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture Kryo 495ARMv8.2-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename - Snapdragon 8cx Gen 2Variant Cortex-A76P-Core Cortex-A55E-Core | Codename Alder Lake-HX Alder Lake-8P-8EVariant Golden CoveP-Core GracemontE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Aug 30, 2020 | Release Date May 10, 2022 |
Foundry TSMC | Foundry Intel |
Fabrication Node N7 | Fabrication Node Intel 7 |
Die Size - | Die Size 202mm² |
Transistor Count - | Transistor Count 14.6 Billion |
Transistor Density - | Transistor Density 72 MTr/mm² |
No images available
No images available