Qualcomm Snapdragon 8cx Gen 3 vs Intel Core Ultra 5 325 Full Specs
8 Cores(4P+4E) 8 Threads(4P+4E) 3GHz | 8 Cores(4P+4E) 8 Threads(4P+4E) 2.1GHz |
TDP - | TDP 25W |
Bandwidth 68.3GB/s LPDDR4X | Bandwidth 119.5GB/s · |
iGPU | iGPU |
·· 7.37 TFLOPSFP16 | ·· 80.28 TFLOPSFP16 |
Socket - | Socket |
Snapdragon 8cx Gen 3-
Core Ultra 5 3253.4GHz8 Cores 4P 4E | 8 Cores 4P 4E |
8 Threads 4P 4E | 8 Threads 4P 4E |
Base Clock 3GHz | Base Clock 2.1GHz |
Boost Clock - | Boost Clock 4.5GHz |
Overclocking Locked | Overclocking Locked |
L0i - | L0i 64KB |
L0d - | L0d 48KB |
L1i 64KB P 64KB E | L1i - 64KB E |
L1d 64KB P 64KB E | L1d 192KB P 32KB E |
L2 1MB P 512KB E - | L2 3MB P - 4MB E shared |
L3 4MB | L3 12MB |
SLC Cache 3MB | SLC Cache - |
Type LPDDR4X | Type · |
Max Memory 16GB | Max Memory 96GB |
ECC No | ECC No |
Channels 8 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 4266MT/s | Speed 7466MT/s |
Bandwidth 68.3GB/s | Bandwidth 119.5GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 68.3GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 119.5GB/s |
TDP - | TDP 25W |
cTDP-down - | cTDP-down 12W |
Peak Power - | Peak Power 55W |
Max Operating Temp - | Max Operating Temp 100°C Max |
- | PCIe PCIe 5.0 x415.8GB/sBandwidth |
- | PCIe Secondary PCIe 4.0 x815.8GB/sBandwidth |
iGPU | iGPU |
Shaders 2048 | Shaders 512 |
Boost Clock 900MHz | Boost Clock 2.45GHz |
·· 7.37 TFLOPSFP16 | ·· 80.28 TFLOPSFP16 |
NPU Model Hexagon | NPU Model NPU 5 |
NPU Cores - | NPU Cores 3 |
Performance 29 TOPS | Performance 47 TOPSINT8 |
Modem Model X62 | Modem Model - |
Cellular 5G mmWave | Cellular - |
Peak Down Up to 4.4Gbps | Peak Down - |
Peak Up Up to 1.6Gbps | Peak Up - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture Kryo 680ARMv8.2-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename - Snapdragon 8cx Gen 3Variant Cortex-X1P-Core - Cortex-A78E-Core | Codename Panther Lake-U Panther Lake-U-4P-4EVariant Cougar CoveP-Core DarkmontM-Core DarkmontE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Dec 22, 2021 | Release Date Jan 5, 2026 |
Foundry Samsung | Foundry Intel |
Other Foundries - | Other Foundries InteliGPU TSMCPCH |
Fabrication Node 5LPE - - | Fabrication Node Intel 18A Intel 3iGPU N6PCH |
Die Size - | Die Size 93mm² 27mm²iGPU 49mm²PCH |
Transistor Count - | Transistor Count 4 MillionPCH |
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