Qualcomm Snapdragon S3 (MSM8260) vs Apple A19 (17e) Full Specs

Summary

2 Cores 2 Threads 1.7GHz	6 Cores(2P+4E) 6 Threads(2P+4E) 4.26GHz
TDP 5W	TDP 5W
Bandwidth 2.7GB/s LPDDR2	Bandwidth 68.3GB/s LPDDR5X
iGPU Adreno 220	iGPU 4-Core A19
Peak·FP32·FP16 34.05 GFLOPSFP16	Peak·FP32·FP16 3.01 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon S3 (MSM8260)-

-

A19 (17e)3,608

x1

Show Top Score

Core Config

2 Cores 2P -	6 Cores 2P 4E
2 Threads 2P -	6 Threads 2P 4E

Clocks

Base Clock 1.7GHz	Base Clock 4.26GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 32KB P -	L1d 128KB P 64KB E
L2 512KB P shared -	L2 8MB P shared 4MB E shared
SLC Cache -	SLC Cache 12MB

Memory

Type LPDDR2	Type LPDDR5X
Max Memory 4GB	Max Memory 8GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 32-bit	Bus Width 64-bit
Speed 666MT/s	Speed 8533MT/s
Bandwidth 2.7GB/s	Bandwidth 68.3GB/s
Bandwidth Calculator Channels Transfer Rate666MT/s Calculated Bandwidth 2.7GB/s	Bandwidth Calculator Channels Transfer Rate8533MT/s Calculated Bandwidth 68.3GB/s

Power & Thermals

TDP 5W	TDP 5W
Peak Power -	Peak Power 11W

Expansion

-	PCIe PCIe 4.0 x3 5.9GB/sBandwidth

iGPU

iGPU Adreno 220	iGPU 4-Core A19
Shaders 32	Shaders 512
Boost Clock 266MHz	Boost Clock 1.47GHz
Peak·FP32·FP16 34.05 GFLOPSFP16	Peak·FP32·FP16 3.01 TFLOPSFP16

NPU

NPU Model Hexagon QDSP6	NPU Model H18 Apollo
NPU Cores -	NPU Cores 16
NPU Clock 400MHz	NPU Clock 2.17GHz
Performance -	Performance 35 TOPSINT8

Cellular

Modem Model Gobi 3000+	Modem Model -
Peak Down Up to 42.2Mbps	Peak Down -
Peak Up Up to 5.8Mbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Apple
ISA AArch32	ISA AArch64
Architecture ScorpionARMv7-A	Architecture Apple Silicon 15ARMv9.2-A
Family S3 Series	Family A Series
Branding	Branding
Codename - - Cortex-A9P-Core -	Codename Tilos A19Variant AS15PP-Core AS15EE-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Sep 9, 2010	Release Date Mar 2, 2026

Fabrication

Foundry Samsung	Foundry TSMC
Fabrication Node 45nm	Fabrication Node N3P
Die Size -	Die Size 83mm²
Transistor Count -	Transistor Count 14.3 Billion
Transistor Density -	Transistor Density 172 MTr/mm²

Images

No images available

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Used In

Smartphones -

Smartphones iPhone 17e

Competitors

QualcommSnapdragon S3 (MSM8260) vs CPU AppleA18 Pro (Neo) QualcommSnapdragon S3 (MSM8260) vs CPU AppleA19 Pro QualcommSnapdragon S3 (MSM8260) vs CPU AppleA19 Show 12 more

AppleA19 (17e) vs CPU AppleA18 Pro (Neo) AppleA19 (17e) vs CPU AppleA18 (16e) AppleA19 (17e) vs CPU AppleA18 Show 12 more