Qualcomm Snapdragon X Elite (X1E-78-100) vs AMD Ryzen AI Max 390 Full Specs

Summary

12 Cores 12 Threads 3.4GHz	12 Cores 24 Threads 3.2GHz
TDP 80W	TDP 65W
Bandwidth 135.2GB/s LPDDR5X	Bandwidth 256GB/s LPDDR5X
iGPU Adreno X1 3.8T	iGPU Radeon 8050S
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16
Socket -	Socket FP11

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon X Elite (X1E-78-100)2,389

x1

Ryzen AI Max 3902,835

x1.19

Show Top Score

Core Config

12 Cores	12 Cores
12 Threads	24 Threads

Clocks

Base Clock 3.4GHz	Base Clock 3.2GHz
Boost Clock -	Boost Clock 5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB	L1i 32KB
L1d 96KB	L1d 48KB
L2 36MB shared	L2 1MB
L3 -	L3 64MB
SLC Cache 6MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR5X
Max Memory 64GB	Max Memory 128GB
ECC No	ECC No
Channels 8	Channels 4
Bus Width 128-bit	Bus Width 256-bit
Speed 8448MT/s	Speed 8000MT/s
Bandwidth 135.2GB/s	Bandwidth 256GB/s
Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s

Power & Thermals

TDP 80W	TDP 65W
cTDP-down -	cTDP-down 45W
cTDP-up -	cTDP-up 120W
Max Operating Temp -	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type -	Bus Type PCIe
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 4.0 x12 23.6GB/sBandwidth	PCIe PCIe 4.0 x16 31.5GB/sBandwidth
PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth	-

iGPU

iGPU Adreno X1 3.8T	iGPU Radeon 8050S
Shaders 1536	Shaders 2048
Boost Clock 1.25GHz	Boost Clock 2.8GHz
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16

NPU

NPU Model Hexagon	NPU Model XDNA 2
NPU Cores -	NPU Cores 32
Performance 45 TOPSINT8	Performance 50 TOPSINT8

Chip

Manufacturer Qualcomm	Manufacturer AMD
ISA AArch64	ISA x86-64
Architecture OryonARMv8.7-A	Architecture Zen 5
Family X Series	Family Ryzen AI 300
Branding	Branding
Codename Hamoa - Snapdragon X EliteVariant PhoenixP-Core	Codename Strix Halo EldoraDie - Zen 5P-Core
Market Segment Laptop	Market Segment Laptop
Release Date Apr 24, 2024	Release Date Jan 6, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries TSMCSoC
Fabrication Node N4P -	Fabrication Node N4X N5SoC
Die Size 170mm²	Die Size 141mm²
Transistor Count -	Transistor Count 16.6 Billion
Transistor Density -	Transistor Density 118 MTr/mm²

Images

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Competitors

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