Qualcomm Snapdragon X Plus (X1P-64-100) vs Qualcomm Snapdragon X2 Elite (X2E-80-100) Full Specs

Summary

10 Cores 10 Threads 3.4GHz	12 Cores(6P+6E) 12 Threads(6P+6E) 4GHz
TDP 23W	TDP 80W
Bandwidth 135.2GB/s LPDDR5X	Bandwidth 152.4GB/s LPDDR5X
iGPU Adreno X1 3.8T	iGPU Adreno X2-85 5.2T
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 10.44 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon X Plus (X1P-64-100)2,349

x1

Snapdragon X2 Elite (X2E-80-100)-

-

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Core Config

10 Cores 10P -	12 Cores 6P 6E
10 Threads 10P -	12 Threads 6P 6E

Clocks

Base Clock 3.4GHz	Base Clock 4GHz
Boost Clock -	Boost Clock 4.7GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P -	L1i 192KB P 128KB E
L1d 96KB P -	L1d 96KB P 64KB E
L2 36MB P shared -	L2 18MB P shared 12MB E shared
SLC Cache 6MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR5X
Max Memory 64GB	Max Memory 128GB
ECC No	ECC No
Channels 8	Channels 8
Bus Width 128-bit	Bus Width 128-bit
Speed 8448MT/s	Speed 9523MT/s
Bandwidth 135.2GB/s	Bandwidth 152.4GB/s
Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s	Bandwidth Calculator Channels Transfer Rate9523MT/s Calculated Bandwidth 152.4GB/s

Power & Thermals

TDP 23W

TDP 80W

Expansion

PCIe PCIe 4.0 x12 23.6GB/sBandwidth	PCIe PCIe 5.0 x8 31.5GB/sBandwidth
PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU Adreno X1 3.8T	iGPU Adreno X2-85 5.2T
Shaders 1536	Shaders 1536
Boost Clock 1.25GHz	Boost Clock 1.7GHz
Peak·FP32·FP16 7.68 TFLOPSFP16	Peak·FP32·FP16 10.44 TFLOPSFP16

NPU

NPU Model Hexagon	NPU Model Hexagon
Performance 45 TOPSINT8	Performance 80 TOPSINT8

Chip

Manufacturer Qualcomm	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture OryonARMv8.7-A	Architecture Oryon 3ARMv8.7-A
Family X Series	Family X Series
Branding	Branding
Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core -	Codename Glymur - Pegasus-PP-Core Pegasus-EE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Apr 24, 2024	Release Date Sep 24, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4P	Fabrication Node N3E
Die Size 170mm²	Die Size 288mm²

Images

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Used In

Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)Inspiron 14 Plus(7441, Late 2024) Show 2 more	Laptops -
Tablets Surface Pro 11(X Elite, Mid 2024)	Tablets -

Competitors

QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen AI 7 350 QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen AI 7 PRO 350 QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen 9 270 Show 12 more

QualcommSnapdragon X2 Elite (X2E-80-100) vs CPU QualcommSnapdragon X2 Elite (X2E-88-100) QualcommSnapdragon X2 Elite (X2E-80-100) vs CPU QualcommSnapdragon X2 Elite Extreme (X2E-96-100) QualcommSnapdragon X2 Elite (X2E-80-100) vs CPU AMDRyzen AI Max 390 Show 12 more