Qualcomm Snapdragon X (X1-26-100) Full Specs

Summary

8 Cores 8 Threads 3GHz

TDP 23W

Bandwidth 135.2GB/s LPDDR5X

iGPU Adreno X1 1.7T

Peak·FP32·FP16 3.41 TFLOPSFP16

Core Config

8 Cores

8 Threads

Clocks

Base Clock 3GHz

Overclocking Locked

Cache

L1i 192KB

L1d 96KB

L2 24MB shared

SLC Cache 6MB

Memory

Type LPDDR5X

Max Memory 64GB

ECC No

Channels 8

Bus Width 128-bit

Speed 8448MT/s

Bandwidth 135.2GB/s

Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s

Power & Thermals

TDP 23W

Expansion

PCIe PCIe 4.0 x12 23.6GB/sBandwidth

PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU Adreno X1 1.7T

Shaders 1024

Boost Clock 833MHz

Peak·FP32·FP16 3.41 TFLOPSFP16

NPU

NPU Model Hexagon

Performance 45 TOPSINT8

Chip

Manufacturer Qualcomm

ISA AArch64

Architecture OryonARMv8.7-A

Family X Series

Branding

Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core

Market Segment Laptop

Release Date Jan 6, 2025

Fabrication

Foundry TSMC

Fabrication Node N4P

Die Size 170mm²

Images

No images available

Competitors

QualcommSnapdragon X (X1-26-100) vs CPU AMDRyzen AI 7 PRO 350 QualcommSnapdragon X (X1-26-100) vs CPU AMDRyzen AI 7 350 QualcommSnapdragon X (X1-26-100) vs CPU AMDRyzen 9 270 Show 12 more