Qualcomm Snapdragon X2 Elite Extreme (X2E-96-100) vs Intel Core Ultra 7 265HX Full Specs
18 Cores(12P+6E) 18 Threads(12P+6E) 4.4GHz | 20 Cores(8P+12E) 20 Threads(8P+12E) 2.6GHz |
TDP 80W | TDP 55W |
Bandwidth 228.6GB/s LPDDR5X | Bandwidth 102.4GB/s DDR5 |
iGPU | iGPU |
·· 15.16 TFLOPSFP16 | ·· 3.89 TFLOPSFP16 |
Socket - | Socket |
Snapdragon X2 Elite Extreme (X2E-96-100)-
Core Ultra 7 265HX4.6GHz18 Cores 12P 6E | 20 Cores 8P 12E |
18 Threads 12P 6E | 20 Threads 8P 12E |
Base Clock 4.4GHz | Base Clock 2.6GHz |
Boost Clock 5GHz | Boost Clock 5.3GHz |
Overclocking Locked | Overclocking Unlocked |
L1i 192KB P 128KB E | L1i 64KB P 64KB E |
L1d 96KB P 64KB E | L1d 48KB P 32KB E |
L2 36MB P shared 12MB E shared | L2 3MB P - 12MB E shared |
L3 - | L3 12MB |
Type LPDDR5X | Type DDR5 |
Max Memory 192GB | Max Memory 192GB |
ECC No | ECC Yes |
Channels 12 | Channels 2 |
Bus Width 192-bit | Bus Width 128-bit |
Speed 9523MT/s | Speed 6400MT/s |
Bandwidth 228.6GB/s | Bandwidth 102.4GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 228.6GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 102.4GB/s |
TDP 80W | TDP 55W |
cTDP-down - | cTDP-down 45W |
Peak Power - | Peak Power 160W |
Max Operating Temp - | Max Operating Temp 105°C Max |
Bus Type - | Bus Type DMI |
Bus Config - | Bus Config 8 lanes |
Bus Speed - | Bus Speed 16GT/s |
Bus Bandwidth - | Bus Bandwidth 16GB/s |
PCIe PCIe 5.0 x1247.3GB/sBandwidth | PCIe PCIe 5.0 x2078.8GB/sBandwidth |
PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth | PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth |
iGPU | iGPU |
Shaders 2048 | Shaders 512 |
Boost Clock 1.85GHz | Boost Clock 1.9GHz |
·· 15.16 TFLOPSFP16 | ·· 3.89 TFLOPSFP16 |
NPU Model Hexagon | NPU Model AI Boost 3 |
NPU Cores - | NPU Cores 2 |
Performance 80 TOPSINT8 | Performance 13 TOPSINT8 |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture Oryon 3ARMv8.7-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename Glymur - Pegasus-PP-Core Pegasus-EE-Core | Codename Arrow Lake-S Arrow Lake-S-8P-16EVariant Lion CoveP-Core SkymontE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Sep 24, 2025 | Release Date Jan 6, 2025 |
Foundry TSMC | Foundry TSMC |
Other Foundries - | Other Foundries TSMCiGPU TSMCIO TSMCSoC |
Fabrication Node N3E - - - | Fabrication Node N3B N5iGPU N6IO N6SoC |
Die Size 288mm² - - - | Die Size 135mm² 23mm²iGPU 28mm²IO 100mm²SoC |
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