UNISOC 8541E vs Apple A19 (17e) Full Specs

Summary

4 Cores 4 Threads 1.4GHz	6 Cores(2P+4E) 6 Threads(2P+4E) 4.26GHz
TDP 3W	TDP 5W
Bandwidth 5.3GB/s LPDDR3·LPDDR2	Bandwidth 68.3GB/s LPDDR5X
iGPU Mali-T820 MP1 680MHz	iGPU 4-Core A19
Peak·FP32·FP16 13.6 GFLOPSFP32	Peak·FP32·FP16 3.01 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

8541E-

-

A19 (17e)3,608

x1

Show Top Score

Core Config

4 Cores 4P -	6 Cores 2P 4E
4 Threads 4P -	6 Threads 2P 4E

Clocks

Base Clock 1.4GHz	Base Clock 4.26GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 32KB P -	L1d 128KB P 64KB E
L2 512KB P - -	L2 8MB P shared 4MB E shared
SLC Cache -	SLC Cache 12MB

Memory

Type LPDDR3·LPDDR2	Type LPDDR5X
Max Memory -	Max Memory 8GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 32-bit	Bus Width 64-bit
Speed 1333MT/s	Speed 8533MT/s
Bandwidth 5.3GB/s	Bandwidth 68.3GB/s
Bandwidth Calculator Channels Transfer Rate1333MT/s Calculated Bandwidth 5.3GB/s	Bandwidth Calculator Channels Transfer Rate8533MT/s Calculated Bandwidth 68.3GB/s

Power & Thermals

TDP 3W	TDP 5W
Peak Power -	Peak Power 11W

Expansion

-	PCIe PCIe 4.0 x3 5.9GB/sBandwidth

iGPU

iGPU Mali-T820 MP1 680MHz	iGPU 4-Core A19
Shaders 10	Shaders 512
Boost Clock 680MHz	Boost Clock 1.47GHz
Peak·FP32·FP16 13.6 GFLOPSFP32	Peak·FP32·FP16 3.01 TFLOPSFP16

NPU

NPU Model -	NPU Model H18 Apollo
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.17GHz
Performance -	Performance 35 TOPSINT8

Cellular

Modem Model UNISOC LTE 4	Modem Model -
Peak Down Up to 150Mbps	Peak Down -
Peak Up Up to 50Mbps	Peak Up -

Chip

Manufacturer UNISOC	Manufacturer Apple
ISA AArch64	ISA AArch64
Architecture ARMv8.0-A	Architecture Apple Silicon 15ARMv9.2-A
Family -	Family A Series
Branding	Branding
Codename - - Cortex-A53P-Core -	Codename Tilos A19Variant AS15PP-Core AS15EE-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Jan 1, 2019	Release Date Mar 2, 2026

Fabrication

Foundry Samsung	Foundry TSMC
Fabrication Node 28nm LP	Fabrication Node N3P
Die Size -	Die Size 83mm²
Transistor Count -	Transistor Count 14.3 Billion
Transistor Density -	Transistor Density 172 MTr/mm²

Images

No images available

No images available

Used In

Smartphones -

Smartphones iPhone 17e

Competitors

UNISOC8541E vs CPU AppleA16 (iPad) UNISOC8541E vs CPU AppleA18 Pro (Neo) UNISOC8541E vs CPU AppleA19 Pro Show 12 more

AppleA19 (17e) vs CPU AppleA18 Pro (Neo) AppleA19 (17e) vs CPU AppleA18 (16e) AppleA19 (17e) vs CPU AppleA18 Show 12 more