FirePro M5725 Specs
FirePro M5725
|
320 Shaders
256MB GDDR3
680MHz
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|
FP32
0.44 TFLOPS
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|
-
-
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Form Factor
Soldered
-
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TDP
25W
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-
-
-
-
-
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GB5 OpenCL - N/A
0%
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GB5 CUDA - N/A
0%
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GB5 Metal - N/A
0%
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GB5 Vulkan - N/A
0%
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OCT 2020.1 - N/A
0%
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OCT Metal - N/A
0%
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Manufacturer
AMD
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Chip Designer
AMD
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Architecture
TeraScale 1
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Family
FirePro M
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Codename
Mario
RV730
Variant
M96 GL
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Market Segment
Laptop
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Release Date
1/1/2009
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Foundry
TSMC
-
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Fabrication Node
55nm
-
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Die Size
146 mm²
-
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Transistor Count
514 Million
-
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Transistor Density
3.52M/mm²
-
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Form
Soldered
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Shading Units
320 Shaders
-
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Texture Mapping Units
32 TMUs
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Render Output Units
8 ROPs
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-
-
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-
-
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-
-
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Compute Units
4 CUs
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|
-
-
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-
-
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-
-
-
680MHz
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|
-
-
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-
-
-
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-
-
-
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|
-
-
-
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FP32
0.44 TFLOPS
|
|
-
-
|
|
-
-
-
|
|
-
-
|
|
-
-
-
|
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Pixel Fillrate
5.44 GPixel/s
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|
-
-
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Texture Fillrate
21.76 GTexel/s
|
|
-
-
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L1
-
-
16KB/CU
-
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L2
256KB Shared
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-
-
-
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256MB
GDDR3
-
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Bus Width
128Bit
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Clock
800MHz
Transfer Rate
1.6GT/s
Bandwidth
25.6GB/s
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-
-
-
-
-
-
-
-
-
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TDP
25W
|
|
-
-
|
|
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
No Ports
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Max Resolution
2560x1600
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Max Resolution Refresh Rate
60Hz
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Variable Refresh Rate
-
-
-
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Display Stream Compression (DSC)
Not Supported
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Multi Monitor Support
2
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-
-
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No Encoders
-
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-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
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Model
UVD 2.0
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Codec
-
-
-
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VC-1
-
-
-
AVC (H.264)
-
-
-
-
-
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Direct X
10
Direct 3D
10_1
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OpenGL
3.3
OpenCL
1.1
-
-
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Shader Model
4.1
-
-
GFX
3
-
-
-
-
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Not a Card
-
-
-
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-
-
-
-
-
-
-
-
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-
-
PCIe Version
2.0
PCIe Lanes
16
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-
-
-
-
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-
-
-
-
-
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