GPUs

Apple 10-Core M3-FL vs Apple 10-Core M2 Full Specs

1,280 Shaders
1.34GHz
1,280 Shaders
1.4GHz
Shared Memory102.4GB/sLPDDR5
Shared Memory102.4GB/sLPDDR5
··
3.42 TFLOPS
··
3.58 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Clock Speed
··
Clock Speed
··
Peak OPS
3.42 TFLOPSFP16
Peak OPS
3.58 TFLOPSFP16
FP32
3.42 TFLOPS
FP32
3.58 TFLOPS
Pixel Rate
53.5 GPixel/s
Pixel Rate
55.9 GPixel/s
Texture Rate
107 GTexel/s
Texture Rate
111.8 GTexel/s

Shaders
1,280 Shaders
Shaders
1,280 Shaders
TMUs
80 TMUs
TMUs
80 TMUs
ROPs
40 ROPs
ROPs
40 ROPs
RT Cores
10 RT-Cores
RT Cores
-
EUs
160 EUs
EUs
160 EUs

Boost Clock
1.34GHz
Boost Clock
1.4GHz

L2 Cache
2MB shared
L2 Cache
2MB shared

Shared MemoryLPDDR5
Shared MemoryLPDDR5
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
6.4GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
102.4GB/s
Memory Bandwidth
102.4GB/s
ECC
No
ECC
No

Multi-Monitor
1
Multi-Monitor
1

Encoder Model
Apple Media Engine 3
Encoder Model
Apple Media Engine 2
Codec
AVC (H.264)
HEVC (H.265)
ProRes
Codec
AVC (H.264)
HEVC (H.265)
ProRes

Decoder Model
Apple Media Engine 3
Decoder Model
Apple Media Engine 2
Codec
AVC (H.264)
HEVC (H.265)
AV1
ProRes
Codec
AVC (H.264)
HEVC (H.265)
-
ProRes

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
M3 branding
Branding
M2 branding
Codename
G15G
Codename
G14G
Market Segment
Tablet
Market Segment
Laptop
Release Date
Oct 30, 2023
Release Date
Jun 6, 2022

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3B
Fabrication Node
N5P
Die Size
153mm²
Die Size
153mm²
Transistor Count
25 Billion
Transistor Count
20.1 Billion
Transistor Density
164 MTr/mm²
Transistor Density
131 MTr/mm²