FirePro 2270 Specs

FirePro 2270
80 Shaders
512MB GDDR3
600MHz
FP32
0.1 TFLOPS
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-
Form Factor
PCIe Card
1.0-Slots
TDP
20W
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-
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GB5 OpenCL - N/A
0%
GB5 CUDA - N/A
0%
GB5 Metal - N/A
0%
GB5 Vulkan - N/A
0%
OCT 2020.1 - N/A
0%
OCT Metal - N/A
0%
Manufacturer
ATI
Chip Designer
ATI
Architecture
TeraScale 2
Family
FirePro
Codename
Cedar
RV810
Variant
Cedar GL
Market Segment
Workstation
Release Date
1/31/2011
Foundry
TSMC
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Fabrication Node
40nm
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Die Size
59 mm²
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Transistor Count
292 Million
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Transistor Density
4.95M/mm²
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Form
PCIe Card
Shading Units
80 Shaders
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Texture Mapping Units
8 TMUs
Render Output Units
4 ROPs
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Compute Units
1 CU
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600MHz
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FP32
0.1 TFLOPS
-
-
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-
-
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Pixel Fillrate
2.4 GPixel/s
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Texture Fillrate
4.8 GTexel/s
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L1
-
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8KB/CU
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L2
128KB Shared
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512MB
GDDR3
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Bus Width
64Bit
Clock
600MHz
Transfer Rate
1.2GT/s
Bandwidth
9.6GB/s
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TDP
20W
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1x DMS-59
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1x DisplayPort 1.0
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Max Resolution
2560x1600
Max Resolution Refresh Rate
60Hz
Variable Refresh Rate
-
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-
Display Stream Compression (DSC)
Not Supported
Multi Monitor Support
2
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No Encoders
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Model
UVD 2.2
Codec
-
-
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VC-1
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AVC (H.264)
-
-
-
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Direct X
11
Direct 3D
11_0
OpenGL
4.5
OpenCL
1.2
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Shader Model
5.0
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GFX
4
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-
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Slots Required
1.0
PCIe Version
2.1
PCIe Lanes
1
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Change Results