FirePro 3D V3750 Specs

FirePro 3D V3750
320 Shaders
256MB GDDR3
550MHz
FP32
0.35 TFLOPS
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Form Factor
PCIe Card
1.0-Slots
TDP
48W
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GB5 OpenCL - N/A
0%
GB5 CUDA - N/A
0%
GB5 Metal - N/A
0%
GB5 Vulkan - N/A
0%
OCT 2020.1 - N/A
0%
OCT Metal - N/A
0%
Manufacturer
ATI
Chip Designer
ATI
Architecture
Terascale 1
Family
FirePro V
Codename
Mario
RV730
Variant
RV730 Pro GL
Market Segment
Workstation
Release Date
9/11/2008
Foundry
TSMC
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Fabrication Node
55nm
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Die Size
146 mm²
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Transistor Count
514 Million
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Transistor Density
3.52M/mm²
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Form
PCIe Card
Shading Units
320 Shaders
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Texture Mapping Units
32 TMUs
Render Output Units
8 ROPs
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Compute Units
4 CUs
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550MHz
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FP32
0.35 TFLOPS
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Pixel Fillrate
4.4 GPixel/s
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Texture Fillrate
17.6 GTexel/s
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L1
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16KB/CU
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L2
256KB Shared
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256MB
GDDR3
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Bus Width
128Bit
Clock
750MHz
Transfer Rate
1.5GT/s
Bandwidth
24GB/s
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TDP
48W
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1x DVI-I Dual-Link
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2x DisplayPort 1.0
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Max Resolution
2560x1600
Max Resolution Refresh Rate
60Hz
Variable Refresh Rate
-
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Display Stream Compression (DSC)
Not Supported
Multi Monitor Support
2
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No Encoders
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Model
UVD 2.0
Codec
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VC-1
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AVC (H.264)
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Direct X
10
Direct 3D
10_1
OpenGL
3.3
OpenCL
1.1
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Shader Model
4.1
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GFX
3
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1x Fan
-
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Slots Required
1.0
PCIe Version
2.0
PCIe Lanes
16
Multi GPU Support
Supported
Type
4-way CrossFireX
Height
111 mm (4.37 in)
Width
168 mm (6.61 in)
Depth
20 mm (0.79 in)
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