Mobility FireGL V3100 Specs

Mobility FireGL V3100
4 Shaders
128MB DDR
350MHz
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Form Factor
Soldered
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TDP
27W
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GB5 OpenCL - N/A
0%
GB5 CUDA - N/A
0%
GB5 Metal - N/A
0%
GB5 Vulkan - N/A
0%
OCT 2020.1 - N/A
0%
OCT Metal - N/A
0%
Manufacturer
AMD
Chip Designer
ATI
Architecture
R300
Family
FireGL V
Codename
Hari
RV370
Variant
M22 GL
Market Segment
Laptop
Release Date
6/1/2004
Foundry
TSMC
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Fabrication Node
110nm
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Die Size
74 mm²
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Transistor Count
107 Million
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Transistor Density
1.45M/mm²
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Form
Soldered
Shading Units
4 Shaders
2 Vertex Shaders
Texture Mapping Units
4 TMUs
Render Output Units
4 ROPs
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350MHz
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Pixel Fillrate
1.4 GPixel/s
Vertex Rate
0.175 GVertices/s
Texture Fillrate
1.4 GTexel/s
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L1
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Unknown
L2
Unknown
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128MB
DDR
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Bus Width
128Bit
Clock
200MHz
Transfer Rate
400MT/s
Bandwidth
6.4GB/s
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TDP
27W
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No Ports
Max Resolution
1920x1200
Max Resolution Refresh Rate
60Hz
Variable Refresh Rate
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Display Stream Compression (DSC)
Not Supported
Multi Monitor Support
2
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No Encoders
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No Decoders
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Direct X
9
Direct 3D
9_0
OpenGL
2.0
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Shader Model
2.0
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GFX
2
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Not a Card
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PCIe Version
1.0
PCIe Lanes
16
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Change Results