GPUs

Apple 10-Core M2-FL vs Apple 5-Core A17 Pro Full Specs

1,280 Shaders
1.4GHz
640 Shaders
1.34GHz
Shared Memory102.4GB/sLPDDR5
Shared Memory51.2GB/sLPDDR5
··
3.58 TFLOPS
··
1.71 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Clock Speed
··
Clock Speed
··
Peak OPS
3.58 TFLOPSFP16
Peak OPS
1.71 TFLOPSFP16
FP32
3.58 TFLOPS
FP32
1.71 TFLOPS
Pixel Rate
55.9 GPixel/s
Pixel Rate
26.8 GPixel/s
Texture Rate
111.8 GTexel/s
Texture Rate
53.5 GTexel/s

Shaders
1,280 Shaders
Shaders
640 Shaders
TMUs
80 TMUs
TMUs
40 TMUs
ROPs
40 ROPs
ROPs
20 ROPs
RT Cores
-
RT Cores
5 RT-Cores
EUs
160 EUs
EUs
80 EUs

Boost Clock
1.4GHz
Boost Clock
1.34GHz

L2 Cache
2MB shared
L2 Cache
768KB shared

Shared MemoryLPDDR5
Shared MemoryLPDDR5
Memory Bus
128-bit
Memory Bus
64-bit
Memory Speed
6.4GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
102.4GB/s
Memory Bandwidth
51.2GB/s
ECC
No
ECC
No

Multi-Monitor
1
Multi-Monitor
1

Encoder Model
Apple Media Engine 2
Encoder Model
Apple Media Engine 3
Codec
AVC (H.264)
HEVC (H.265)
ProRes
Codec
AVC (H.264)
HEVC (H.265)
ProRes

Decoder Model
Apple Media Engine 2
Decoder Model
Apple Media Engine 3
Codec
AVC (H.264)
HEVC (H.265)
-
ProRes
Codec
AVC (H.264)
HEVC (H.265)
AV1
ProRes

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
M2 branding
Branding
A17 Pro branding
Codename
G14G
Codename
G16P
Market Segment
Tablet
Market Segment
Smartphone
Release Date
Jun 6, 2022
Release Date
Oct 15, 2024

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N5P
Fabrication Node
N3B
Die Size
153mm²
Die Size
104mm²
Transistor Count
20.1 Billion
Transistor Count
19 Billion
Transistor Density
131 MTr/mm²
Transistor Density
183 MTr/mm²