Apple 10-Core M3-FL vs NVIDIA GeForce RTX 3050 Laptop 80W Full Specs
1,280 Shaders 1.34GHz | 2,048 Shaders 1.74GHz |
Shared Memory102.4GB/sLPDDR5 | 4GB GDDR6192GB/s placeholder |
·· 3.42 TFLOPS | ·· 7.13 TFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP Shared | TDP 80W |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 3.42 TFLOPSFP16 | Peak OPS 228.1 TOPSINT4 Tensor Sparse |
FP16 3.42 TFLOPSTensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 -FP16-32 Tensor Sparse - | FP16 7.13 TFLOPSTensor FP16-16 28.51 TFLOPSFP16-16 Tensor Sparse 57.02 TFLOPSTensor FP16-32 14.25 TFLOPSFP16-32 Tensor Sparse 28.51 TFLOPS |
- | BF16 7.13 TFLOPSTensor BF16 14.25 TFLOPSBF16 Tensor Sparse 28.51 TFLOPS |
Tensor TF32 - | Tensor TF32 7.13 TFLOPS |
FP32 3.42 TFLOPS | FP32 7.13 TFLOPS |
- | FP64 111.4 GFLOPS |
Tensor INT4 - | Tensor INT4 114 TOPS |
- | Tensor INT8 57.02 TOPS |
Ray - | Ray 10.75 TOPS |
Pixel Rate 53.5 GPixel/s | Pixel Rate 55.7 GPixel/s |
Texture Rate 107 GTexel/s | Texture Rate 111.4 GTexel/s |
Shaders 1,280 Shaders | Shaders 2,048 Shaders |
TMUs 80 TMUs | TMUs 64 TMUs |
ROPs 40 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 64 T-Cores |
RT Cores 10 RT-Cores | RT Cores 16 RT-Cores |
EUs 160 EUs | SMs 16 SMs |
Base Clock - | Base Clock 1.49GHz |
Boost Clock 1.34GHz | Boost Clock 1.74GHz |
L1 - | L1 64KB/SM Tex |
L2 Cache 2MB shared | L2 Cache 2MB shared |
Shared MemoryLPDDR5 | 4GB GDDR6 placeholder |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 6.4GT/s | Memory Speed 12GT/s |
Memory Bandwidth 102.4GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP Shared | TDP 80W |
Max Resolution 7680x4320 | Max Resolution 7680x4320 |
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz | Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz |
Multi-Monitor 1 | Multi-Monitor 3 |
Adaptive Sync - | Adaptive Sync G-Sync FreeSync |
DSC Supported | DSC Supported |
HDCP - | HDCP HDCP 2.3 |
Shader Model - | Shader Model 6.6 |
- | DirectX DirectX 12Direct3D 12_2 |
- | OpenGL 4.6OpenCL 3Vulkan 1.2 |
- | CUDA 8.6PureVideo HD VP11VDPAU Feature Set K |
Encoder Apple Media Engine 3 | Encoder NVENC 7 |
Codec AVC (H.264) HEVC (H.265) ProRes | Codec AVC (H.264) HEVC (H.265) - |
Decoder Apple Media Engine 3 | Decoder NVDEC 5 |
Codec - - - - - - AVC (H.264) HEVC (H.265) AV1 ProRes | Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 - |
Form Factor iGPU | Form Factor Soldered |
PCIe - | PCIe PCIe 4.0 x8 |
Cooling Passive | Cooling Open-Air |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename G15G | Codename NV177 |
Chip Variant - | Chip Variant GA107-140-A1 |
Market Segment Tablet | Market Segment Laptop |
Release Date Oct 30, 2023 | Release Date May 11, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N3B | Fabrication Node 8N |
Die Size 153mm² | Die Size 200mm² |
Transistor Count 25B | Transistor Count 8.7B |
Transistor Density 164 MTr/mm² | Transistor Density 43.5 MTr/mm² |





