Apple 10-Core M3 vs NVIDIA GeForce GTX 1060 Full Specs
1,280 Shaders 1.34GHz | 1,280 Shaders 1.71GHz |
Shared Memory102.4GB/sLPDDR5 | 6GB GDDR5192GB/s placeholder |
·· 3.42 TFLOPS | ·· 4.37 TFLOPS |
Form Factor iGPU | Form Factor PCIe Card |
TDP Shared | TDP 120W |
Power Connectors - | Power Connectors 1x 6-Pin |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 3.42 TFLOPSFP16 | Peak OPS 4.37 TFLOPSFP32 |
FP32 3.42 TFLOPS | FP32 4.37 TFLOPS |
- | FP64 136.6 GFLOPS |
Pixel Rate 53.5 GPixel/s | Pixel Rate 82 GPixel/s |
Texture Rate 107 GTexel/s | Texture Rate 136.6 GTexel/s |
Shaders 1,280 Shaders | Shaders 1,280 Shaders |
TMUs 80 TMUs | TMUs 80 TMUs |
ROPs 40 ROPs | ROPs 48 ROPs |
RT Cores 10 RT-Cores | RT Cores - |
EUs 160 EUs | SMs 10 SMs |
Base Clock - | Base Clock 1.51GHz |
Boost Clock 1.34GHz | Boost Clock 1.71GHz |
L2 Cache 2MB shared | L2 Cache 1.5MB shared |
Shared MemoryLPDDR5 | 6GB GDDR5 placeholder |
Memory Bus 128-bit | Memory Bus 192-bit |
Memory Speed 6.4GT/s | Memory Speed 8GT/s |
Memory Bandwidth 102.4GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP Shared | TDP 120W |
Multi-Monitor 1 | Multi-Monitor 3 |
- | 3x DisplayPort 1.4 1x HDMI 2.0 1x DVI-D Dual-Link |
Encoder Model Apple Media Engine 3 | Encoder Model NVENC 4 |
Codec AVC (H.264) HEVC (H.265) ProRes | Codec AVC (H.264) HEVC (H.265) - |
Decoder Model Apple Media Engine 3 | Decoder Model NVDEC 3 |
Codec - - - - - AVC (H.264) HEVC (H.265) AV1 ProRes | Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP9 AVC (H.264) HEVC (H.265) - - |
Form Factor iGPU | Form Factor PCIe Card |
PCIe - | PCIe 2-Slots |
- | Height 112 mm (4.41")Width 250 mm (9.84")Depth 40 mm (1.57") |
Cooling Open-Air - | Cooling Blower 1x Fan |
Power Connectors - | Power Connectors 1x 6-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename G15G | Codename NV136 |
Chip Variant - | Chip Variant GP106-300-A1 |
Market Segment Laptop | Market Segment Desktop |
Release Date Oct 30, 2023 | Release Date Jul 19, 2016 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N3B | Fabrication Node 16FF |
Die Size 153mm² | Die Size 200mm² |
Transistor Count 25 Billion | Transistor Count 4.4 Billion |
Transistor Density 164 MTr/mm² | Transistor Density 22 MTr/mm² |

