Apple 10-Core M5 vs NVIDIA GeForce RTX 3060 Laptop 110W Full Specs
1,280 Shaders 1.62GHz | 3,840 Shaders 1.68GHz |
Shared Memory153.6GB/sLPDDR5X | 6GB GDDR6336GB/s placeholder |
·· 4.15 TFLOPS | ·· 12.9 TFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP Shared | TDP 110W |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 33.18 TOPSINT8 Tensor | Peak OPS 412.9 TOPSINT4 Tensor Sparse |
Tensor FP16-16 8.29 TFLOPSFP16-16 Tensor Sparse -Tensor FP16-32 8.29 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 51.61 TFLOPSFP16-16 Tensor Sparse 103.2 TFLOPSTensor FP16-32 25.8 TFLOPSFP16-32 Tensor Sparse 51.61 TFLOPS |
BF16 -Tensor BF16 16.59 TFLOPSBF16 Tensor Sparse - | BF16 12.9 TFLOPSTensor BF16 25.8 TFLOPSBF16 Tensor Sparse 51.61 TFLOPS |
Tensor TF32 - | Tensor TF32 12.9 TFLOPS |
FP32 4.15 TFLOPS | FP32 12.9 TFLOPS |
- | FP64 201.6 GFLOPS |
Tensor INT4 - | Tensor INT4 206.4 TOPS |
Tensor INT8 33.18 TOPS | Tensor INT8 103.2 TOPS |
Ray - | Ray 19.46 TOPS |
Pixel Rate 64.8 GPixel/s | Pixel Rate 80.6 GPixel/s |
Texture Rate 129.6 GTexel/s | Texture Rate 201.6 GTexel/s |
Shaders 1,280 Shaders | Shaders 3,840 Shaders |
TMUs 80 TMUs | TMUs 120 TMUs |
ROPs 40 ROPs | ROPs 48 ROPs |
Tensor Cores 10 T-Cores | Tensor Cores 120 T-Cores |
RT Cores 10 RT-Cores | RT Cores 30 RT-Cores |
EUs 160 EUs | SMs 30 SMs |
Base Clock - | Base Clock 1.34GHz |
Boost Clock 1.62GHz | Boost Clock 1.68GHz |
L2 Cache 2MB shared | L2 Cache 3MB shared |
Shared MemoryLPDDR5X | 6GB GDDR6 placeholder |
Memory Bus 128-bit | Memory Bus 192-bit |
Memory Speed 9.6GT/s | Memory Speed 14GT/s |
Memory Bandwidth 153.6GB/s | Memory Bandwidth 336GB/s |
ECC No | ECC No |
TDP Shared | TDP 110W |
Multi-Monitor 2 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model Apple Media Engine 3 | Encoder Model NVENC 7 |
Codec AVC (H.264) HEVC (H.265) ProRes | Codec AVC (H.264) HEVC (H.265) - |
Decoder Model Apple Media Engine 3 | Decoder Model NVDEC 5 |
Codec - - - - - - AVC (H.264) HEVC (H.265) AV1 ProRes | Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 - |
Form Factor iGPU | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename G17G | Codename NV176 |
Chip Variant - | Chip Variant GA106-150-KA-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Oct 15, 2025 | Release Date Feb 25, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N3P | Fabrication Node 8N |
Die Size - | Die Size 276mm² |
Transistor Count - | Transistor Count 13.3 Billion |
Transistor Density - | Transistor Density 48.01 MTr/mm² |

