Apple 16-Core M1 Pro vs NVIDIA GeForce RTX 3060 Laptop 80W Full Specs

Summary

2,048 Shaders 1.3GHz	3,840 Shaders 1.43GHz
Shared Memory204.8GB/sLPDDR5	6GB GDDR6336GB/s placeholder
Peak·FP32·FP16 5.31 TFLOPS	Peak·FP32·FP16 10.94 TFLOPS
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP 80W

Theoretical Performance

Clock Speed1296MHz UC·Boost·OC	Clock Speed1425MHz UC·Base·Boost·OC
Peak OPS 5.31 TFLOPSFP16	Peak OPS 350.2 TOPSINT4 Tensor Sparse
-	Tensor FP16-16 43.78 TFLOPS FP16-16 Tensor Sparse 87.55 TFLOPS Tensor FP16-32 21.89 TFLOPS FP16-32 Tensor Sparse 43.78 TFLOPS
-	BF16 10.94 TFLOPS Tensor BF16 21.89 TFLOPS BF16 Tensor Sparse 43.78 TFLOPS
Tensor TF32 -	Tensor TF32 10.94 TFLOPS
FP32 5.31 TFLOPS	FP32 10.94 TFLOPS
-	FP64 171 GFLOPS
Tensor INT4 -	Tensor INT4 175.1 TOPS
-	Tensor INT8 87.55 TOPS
Ray -	Ray 16.51 TOPS
Pixel Rate 82.9 GPixel/s	Pixel Rate 68.4 GPixel/s
Texture Rate 165.9 GTexel/s	Texture Rate 171 GTexel/s

Core Config

Shaders 2,048 Shaders	Shaders 3,840 Shaders
TMUs 128 TMUs	TMUs 120 TMUs
ROPs 64 ROPs	ROPs 48 ROPs
Tensor Cores -	Tensor Cores 120 T-Cores
RT Cores -	RT Cores 30 RT-Cores
EUs 256 EUs	SMs 30 SMs

Clocks

Base Clock -	Base Clock 900MHz
Boost Clock 1.3GHz	Boost Clock 1.43GHz

Cache

L2 Cache 2MB shared

L2 Cache 3MB shared

Memory

Shared MemoryLPDDR5	6GB GDDR6 placeholder
Memory Bus 256-bit	Memory Bus 192-bit
Memory Speed 6.4GT/s	Memory Speed 14GT/s
Memory Bandwidth 204.8GB/s	Memory Bandwidth 336GB/s
ECC No	ECC No

Power & Thermals

TDP Shared

TDP 80W

Video Output

Multi-Monitor 2	Multi-Monitor 3
HDCP -	HDCP HDCP 2.3

Encoder

Encoder Model Apple Media Engine 2	Encoder Model NVENC 7
Codec AVC (H.264) HEVC (H.265) ProRes	Codec AVC (H.264) HEVC (H.265) -

Decoder

Decoder Model Apple Media Engine 2	Decoder Model NVDEC 5
Codec - - - - - - AVC (H.264) HEVC (H.265) - ProRes	Codec MPEG-1 MPEG-2 MPEG-4 VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 -

Card

Form Factor iGPU

Form Factor Soldered

Chip

Manufacturer Apple	Manufacturer NVIDIA
Chip Designer Apple	Chip Designer NVIDIA
Architecture Apple Gen 4	Architecture Ampere
Family M Series	Family GeForce 30
Branding	Branding
Codename G13S	Codename NV176
Chip Variant -	Chip Variant GA106-150-KA-A1
Market Segment Laptop	Market Segment Laptop
Release Date Oct 26, 2021	Release Date Feb 25, 2021

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N5	Fabrication Node 8N
Die Size 253mm²	Die Size 276mm²
Transistor Count 33.7 Billion	Transistor Count 13.3 Billion
Transistor Density 133 MTr/mm²	Transistor Density 48.01 MTr/mm²

Images