GPUs

Apple 16-Core M2 Pro vs Apple 10-Core M3 Full Specs

2,048 Shaders
1.4GHz
1,280 Shaders
1.34GHz
Shared Memory204.8GB/sLPDDR5
Shared Memory102.4GB/sLPDDR5
··
5.73 TFLOPS
··
3.42 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Clock Speed
··
Clock Speed
··
Peak OPS
5.73 TFLOPSFP16
Peak OPS
3.42 TFLOPSFP16
FP32
5.73 TFLOPS
FP32
3.42 TFLOPS
Pixel Rate
89.5 GPixel/s
Pixel Rate
53.5 GPixel/s
Texture Rate
178.9 GTexel/s
Texture Rate
107 GTexel/s

Shaders
2,048 Shaders
Shaders
1,280 Shaders
TMUs
128 TMUs
TMUs
80 TMUs
ROPs
64 ROPs
ROPs
40 ROPs
RT Cores
-
RT Cores
10 RT-Cores
EUs
256 EUs
EUs
160 EUs

Boost Clock
1.4GHz
Boost Clock
1.34GHz

L2 Cache
4MB shared
L2 Cache
2MB shared

Shared MemoryLPDDR5
Shared MemoryLPDDR5
Memory Bus
256-bit
Memory Bus
128-bit
Memory Speed
6.4GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
204.8GB/s
Memory Bandwidth
102.4GB/s
ECC
No
ECC
No

Multi-Monitor
2
Multi-Monitor
1

Encoder Model
Apple Media Engine 2
Encoder Model
Apple Media Engine 3
Codec
AVC (H.264)
HEVC (H.265)
ProRes
Codec
AVC (H.264)
HEVC (H.265)
ProRes

Decoder Model
Apple Media Engine 2
Decoder Model
Apple Media Engine 3
Codec
AVC (H.264)
HEVC (H.265)
-
ProRes
Codec
AVC (H.264)
HEVC (H.265)
AV1
ProRes

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
M2 Pro branding
Branding
M3 branding
Codename
G14S
Codename
G15G
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 17, 2023
Release Date
Oct 30, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N5P
Fabrication Node
N3B
Die Size
295mm²
Die Size
153mm²
Transistor Count
40 Billion
Transistor Count
25 Billion
Transistor Density
136 MTr/mm²
Transistor Density
164 MTr/mm²