Apple 20-Core M4 Pro vs Apple 6-Core A17 Pro Full Specs

Summary

2,560 Shaders 1.58GHz	768 Shaders 1.34GHz
Shared Memory273.1GB/sLPDDR5X	Shared Memory51.2GB/sLPDDR5
Peak·FP32·FP16 8.08 TFLOPS	Peak·FP32·FP16 2.06 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Memory Bandwidth

20-Core M4 Pro8.08 TFLOPSFP16

x3.93

6-Core A17 Pro2.06 TFLOPSFP16

x1

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Theoretical Performance

Clock Speed1578MHz UC·Boost·OC	Clock Speed1338MHz UC·Boost·OC
Peak OPS 8.08 TFLOPSFP16	Peak OPS 2.06 TFLOPSFP16
FP32 8.08 TFLOPS	FP32 2.06 TFLOPS
Pixel Rate 126.2 GPixel/s	Pixel Rate 32.1 GPixel/s
Texture Rate 252.5 GTexel/s	Texture Rate 64.2 GTexel/s

Core Config

Shaders 2,560 Shaders	Shaders 768 Shaders
TMUs 160 TMUs	TMUs 48 TMUs
ROPs 80 ROPs	ROPs 24 ROPs
RT Cores 20 RT-Cores	RT Cores 6 RT-Cores
EUs 320 EUs	EUs 96 EUs

Clocks

Boost Clock 1.58GHz

Boost Clock 1.34GHz

Cache

L2 Cache 4MB shared

L2 Cache 768KB shared

Memory

Shared MemoryLPDDR5X	Shared MemoryLPDDR5
Memory Bus 256-bit	Memory Bus 64-bit
Memory Speed 8.5GT/s	Memory Speed 6.4GT/s
Memory Bandwidth 273.1GB/s	Memory Bandwidth 51.2GB/s
ECC No	ECC No

Video Output

Max Resolution 7680x4320	Max Resolution 3840x2160
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 120Hz	Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 60Hz
Multi-Monitor 3	Multi-Monitor 1
DSC Supported	DSC Not Supported

Encoder

Encoder Apple Media Engine 3	Encoder Apple Media Engine 3
Codec AVC (H.264) HEVC (H.265) ProRes	Codec AVC (H.264) HEVC (H.265) ProRes

Decoder

Decoder Apple Media Engine 3	Decoder Apple Media Engine 3
Codec AVC (H.264) HEVC (H.265) AV1 ProRes	Codec AVC (H.264) HEVC (H.265) AV1 ProRes

Card

Form Factor iGPU	Form Factor iGPU
Cooling Blower 2x Fans	Cooling Open-Air -

Chip

Manufacturer Apple	Manufacturer Apple
Chip Designer Apple	Chip Designer Apple
Architecture Apple Gen 7	Architecture Apple Gen 6
Family M Series	Family A Series
Branding	Branding
Codename G16S	Codename G16P
Market Segment Laptop	Market Segment Smartphone
Release Date Oct 29, 2024	Release Date Sep 12, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3E	Fabrication Node N3B
Die Size 325mm²	Die Size 104mm²
Transistor Count 55B	Transistor Count 19B
Transistor Density 169 MTr/mm²	Transistor Density 183 MTr/mm²

Images